Abstract: Water soluble polymers are incorporated into cellulose adhesives comprising phenol formaldehyde and related formaldehyde resins to impart more resistance to sagging and to increase the open time of the adhesive. A preferred use of the modified adhesive is as an adhesive for assembling engineered wood products such as strand board, particle board, medium density fiberboard, plywood and engineered products such as I-beams. The water soluble polymers achieve the objectives of increased sag resistance and more open time by increasing the viscosity of the adhesive and slowing the loss of water to the cellulose products and the air during use of the adhesive.

Abstract: A new silicon based semiconductor device comprises a layer of amorphous silicon in which the density of energy states in the energy gap has been reduced by hydrogenation; this layer is deposited on a layer of a hydrogen-containing substrate material that can supply hydrogen in atomic form to the amorphous silicon. In processes of the invention the silicon layer and a substrate layer are hydrogenated separately to permit optimum hydrogenation; the silicon layer may be deposited without hydrogenation and hydrogenated subsequently with hydrogen from the substrate material. A specific example consists of a layer of hydrogenated amorphous silicon of about 1 micrometer thickness deposited on a hydrogen-containing chromium layer which is itself deposited on a carrier, the silicon then forming the active element of a photovoltaic cell particularly functional as a solar cell.