Patents by Inventor John Peter Redmond

John Peter Redmond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for rendering kapton or other polyimide film photo sensitive to catalyst for the deposition of various metals in pattern thereon
    Patent number: 4112139
    Abstract: Deposition of metal onto a polyimide film by an electroless method is disclosed. The subject method finds particular application in generating metal patterns on polyimide substrates, such as films. The subject method employs a photographic like technique for generating on a polyimide substrate, a pattern capable of attracting thereon a precious metal-salt which is useable as a catalyst in an electroless plating process. The methods disclosed are useable in an electroless plating process to produce a metallic pattern, such as an electric circuit pattern for mounting integrated circuit chips, etc.
    Type: Grant
    Filed: September 20, 1976
    Date of Patent: September 5, 1978
    Assignee: AMP Incorporated
    Inventors: Albert Shirk, John Peter Redmond
  • Method of making sensitized polyimide polymers, having catalyst and electroless metal, metal deposits thereon and circuit patterns of various metallization schemes
    Patent number: 4078096
    Abstract: A method is disclosed for the generation of circuit patterns on a polyimide type of substrate by preconditioning the substrate's surface with a hydrazine/caustic solution, depositing a catalyst on the surface treated polymer, and exposing the polymer with the catalyst thereon to a bath having a metal therein capable of deposition electrolessly on the polymer surface containing catalyst.
    Type: Grant
    Filed: September 20, 1976
    Date of Patent: March 7, 1978
    Assignee: AMP Incorporated
    Inventors: John Peter Redmond, Albert Shirk, Elmer John Bottiglier, Richard Henry Zimmerman
  • Gold deposition procedures and substrates upon which gold has been deposited
    Patent number: 4009297
    Abstract: A method for electroless gold plating in which gold ligand complexes are used; a photolytic method for depositing catalytic amounts of gold on a substrate suitable for an electroless metal deposition method whereby the gold complexes used are trivalent gold complex; a method for immersion plating or vaporization plating of gold from complexes, and complexes for the above methods.
    Type: Grant
    Filed: February 25, 1974
    Date of Patent: February 22, 1977
    Assignee: AMP Incorporated
    Inventors: John Peter Redmond, Daniel Marshall Andrews, Karl Edward Guyler