Abstract: An apparatus and method are provided for automatic visual inspection of crescent-shaped wire bonds. The apparatus includes image acquisition means for acquiring an image of a wire and an image of a crescent-shaped wire bond. A search model is used that includes a crescent-modeling portion, and can also advantageously include a wire modeling portion. Search functionality is used to find an image of the crescent-shaped wire bond, using the search model, so as to provide location information regarding the location of the crescent base, and shape-match information regarding the reliability of the found location information. The invention is useful for verifying the correct position of the crescent bond to ensure good electrical contact. In addition, the invention greatly simplifies the task of two other important automated visual inspection steps: wire location and crescent shape determination. Presence/absence of the crescent bond can also be determined using this information.