Patents by Inventor John Ping Sheung Lau

John Ping Sheung Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for dressing molded array package saw blade
    Patent number: 6903304
    Abstract: A process for reworking or dressing a saw blade used in wafer dicing and singulation of molded array integrated circuit packages, includes rotating the saw blade on a spindle and ablating an edge portion of the saw blade using a laser and thereby dressing the saw blade.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: June 7, 2005
    Assignee: Asat Ltd.
    Inventors: Neil McLellan, Chun Ho Fan, Geraldine Tsui Yee Lin, John Ping Sheung Lau