Patents by Inventor John Posthill

John Posthill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE SAME
    Publication number: 20220246497
    Abstract: A microelectronic structure with through substrate vias (TSVs) and method for forming the same is disclosed. The microelectronic structure can include a bulk semiconductor with a via structure. The via structure can have a first and second conductive portion. The via structure can also have a barrier layer between the first conductive portion and the bulk semiconductor. The structure can have a second barrier layer between the first and second conductive portions. The second conductive portion can extend from the second barrier layer to the upper surface of the bulk semiconductor. The microelectronic structure containing TSVs is configured so that the microelectronic structure can be bonded to a second element or structure.
    Type: Application
    Filed: December 27, 2021
    Publication date: August 4, 2022
    Inventors: Gaius Gillman Fountain, JR., Cyprian Emeka Uzoh, George Carlton Hudson, John Posthill
  • Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
    Patent number: 7997087
    Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: August 16, 2011
    Inventors: Rama Venkatasubramanian, Randall G. Alley, Pratima Addepalli, Anil J. Reddy, Edward P. Siivola, Brooks C. O'Quinn, Kip D. Coonley, John Posthill, Thomas Colpitts
  • Thin film thermoelectric devices for power conversion and cooling
    Publication number: 20100257871
    Abstract: A thermoelectric device having at least one thermoelectric unit including at least one thermoelectric pair of n-type and p-type thermoelements, a first header coupled to one side of the thermoelectric pair, and a second header coupled to a second side of the thermoelectric pair. The thermoelectric pair has a thermal conduction channel area smaller than an area of the first header or the second header such that the thermal conduction area is a fraction of the area of the first header or the second header.
    Type: Application
    Filed: December 18, 2006
    Publication date: October 14, 2010
    Inventors: Rama Venkatasubramanian, Brooks C. O'Quinn, Edward P. Siivola, Kip D. Coonley, Pratima Addepalli, Randall G. Alley, John Posthill, Thomas Colpitts, Anil J. Reddy, James Christopher Caylor, Peter Thomas
  • Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics
    Publication number: 20090282852
    Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
    Type: Application
    Filed: March 13, 2009
    Publication date: November 19, 2009
    Inventors: Rama Venkatasubramanian, Randall G. Alley, Pratima Addepalli, Anil J-Reddy, Edward P. Siivola, Brooks C. O'Quinn, Kip D. Coonley, John Posthill, Thomas Colpitts
  • Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
    Patent number: 7523617
    Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: April 28, 2009
    Assignee: Nextreme Thermal Solutions, Inc.
    Inventors: Rama Venkatasubramanian, Randall G. Alley, Pratima Addepalli, Anil J. Reddy, Edward P. Siivola, Brooks C. O'Quinn, Kip D. Coonley, John Posthill, Thomas Colpitts
  • Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
    Publication number: 20060086118
    Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
    Type: Application
    Filed: October 22, 2004
    Publication date: April 27, 2006
    Applicant: Research Triangle Insitute
    Inventors: Rama Venkatasubramanian, Randall Alley, Pratima Addepalli, Anil Reddy, Edward Siivola, Brooks O'Quinn, Kip Coonley, John Posthill, Thomas Colpitts