Patents by Inventor John Prikkel

John Prikkel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12163565
    Abstract: An insert to a mold for a leaf spring comprises a substrate and a hole that extends through the substrate, A post protrudes from the substrate such that the insert, may be coupled to the mold. Further, the post covers the hole on a first end, so the hole is not exposed. On the other end of the hole, a thin overlay that covers the hole. Thus, during a process where resin is added to the mold, no resin enters the hole. The insert, when added to a leaf spring, offers reinforcement on areas where there is high stress. Therefore, holes may be added to a leaf spring at areas of high stress without overly weakening the leaf spring.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: December 10, 2024
    Assignee: Hendrickson USA, L.L.C.
    Inventor: John Prikkel
  • Publication number: 20220065319
    Abstract: An insert to a mold for a leaf spring comprises a substrate and a hole that extends through the substrate, A post protrudes from the substrate such that the insert, may be coupled to the mold. Further, the post covers the hole on a first end, so the hole is not exposed. On the other end of the hole, a thin overlay that covers the hole. Thus, during a process where resin is added to the mold, no resin enters the hole. The insert, when added to a leaf spring, offers reinforcement on areas where there is high stress. Therefore, holes may be added to a leaf spring at areas of high stress without overly weakening the leaf spring.
    Type: Application
    Filed: January 17, 2020
    Publication date: March 3, 2022
    Inventor: John Prikkel