Abstract: A method of correcting aperture size variations on an aperture plate, includes characterizing variations in aperture size in an array of apertures in a nozzle plate, obtaining a transfer function that relates mask aperture size to a final ablated aperture size, and using the transfer function to create a modified imaging mask.

Abstract: A fluidic structure formed in a film, including a particle filter formed at a bottom surface of the film having a depth less than a thickness of the film, a cavity fluidically connected to the particle filter extending from a top of the particle filter to a top surface of the film, an inlet fluidically connected to and positioned adjacent to the cavity, the inlet having a depth less than or equal to a thickness of the film and extending to the top surface of the film, and a body port extending from the top surface of the film into some depth of the film , the body port fluidically connected to the inlet.

Abstract: The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.

Abstract: Inkjet printheads containing a first plate, a second plate, and a cured adhesive composition disposed between and bonding the first plate and the second plate. The cured adhesive composition has a glass transition temperature of greater than about 115° C. and is stable when exposed to acrylate monomer. Also, inkjet printheads having a first plate, a second plate, and a cured thin film adhesive disposed between and bonding to both of the first plate and the second plate. The cured thin film adhesive contains a polyimide film disposed between a cured first adhesive layer and a cured second adhesive layer. Methods of preparing such inkjet printheads.

Abstract: Inkjet printheads containing a first plate, a second plate, and a cured adhesive composition disposed between and bonding the first plate and the second plate. The cured adhesive composition has a glass transition temperature of greater than about 115° C. and is stable when exposed to acrylate monomer. Also, inkjet printheads having a first plate, a second plate, and a cured thin film adhesive disposed between and bonding to both of the first plate and the second plate. The cured thin film adhesive contains a polyimide film disposed between a cured first adhesive layer and a cured second adhesive layer. Methods of preparing such inkjet printheads.

Abstract: A process where there is deposited on a supporting substrate at least one first polymer layer and optionally at least one second polymer layer followed by treating the resulting formed layers or laminate with a laser.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight, swell, and/or oxidize when exposed to certain inks such as ultraviolet inks and pigmented inks. An embodiment of the present teachings can include processing of an adhesive including a processes a particular adhesive comprising a cresol novolac resin and a dicydiandiamide curing agent using a particular process, such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: A process where there is deposited on a supporting substrate at least one first polymer layer and optionally at least one second polymer layer followed by treating the resulting formed layers or laminate with a laser.

Abstract: A printhead for printing ink includes a particulate filter manufactured from a polymer sheet such as a polyimide sheet. Filter openings within the particulate filter can be formed using a mask and a laser beam to ablate exposed portions of the polymer sheet. Embodiments of the present teachings can result in the formation smaller filter openings at a smaller pitch within the polymer sheet than, for example, stainless steel particulate filters, and thus more openings which cover a larger percentage of the filter surface for a given filter size, which can result in a reduction of fluid pressure within the printhead. Thus smaller filter openings for improved filtering of smaller particulates can be formed while maintaining a sufficient ink flow at a sufficiently low pressure within the printhead during operation.

Abstract: A method of manufacturing a print head includes forming a jet stack having an array of jets, arranging an array of transducers on the jet stack such that each transducer in the array of transducers corresponds to each jet in the array of jets, embossing a flexible circuit substrate having contact pads such that the contact pads extend out of a plane of the flexible circuit substrate, and arranging the flexible circuit substrate such that the contact pads electrically connect to at least some of the transducers in the array of transducers.

Abstract: A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.

Abstract: A method includes attaching multiple layers to a back side of at least a portion of a fluid dispensing subassembly having at least one inlet port to form a fluid dispensing assembly, aligning a laser to a region of the fluid dispensing assembly, the region corresponding to the inlet port, and forming at least one hole in the region using a laser, the hole completing a path through the layers to the inlet port. A fluid dispensing assembly has a fluid dispensing subassembly having at least one inlet port, a fluid manifold having at least one outlet, at least two layers between the fluid dispensing subassembly and the manifold, and a fluid path in the at least two layers between the outlet and the inlet port, the fluid path having smooth walls and substantially uniform width.

Abstract: Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more stepped nozzles each with an associated entrance diameter and exit diameter. Ink can be received into the printhead and formed into ink drops in the stepped nozzles. The ink drops can each have an associated drop mass and drop speed. The stepped nozzles can be provided such that the exit diameter can independently dictate the drop mass and the entrance diameter can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.

Abstract: A print head has a jet stack having an array of jets, an array of transducers arranged on the jet stack such that each transducer corresponds to a jet in the array of jets, and a flexible circuit substrate arranged adjacent the array of transducers such that contact pads on the flexible circuit substrate make electrical connection to at least some of the array of transducers, the flexible circuit substrate being embossed so that the contact pads extend out of a plane of the flexible circuit substrate.

Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Abstract: An electronic device has an electronic signal source electrically connected to a signal routing circuit, an electrically activated transducer to receive electronic signals through the signal routing circuit, and an anisotropic conductive film to provide electrical continuity between the signal routing circuit and the transducer, the anisotropic conductive film having material removed adjacent the transducer to reduce mechanical loading of the transducer.

Abstract: A fluid dispensing subassembly, includes a first set of plates including a diaphragm to be operated on by a transducer, a second set of plates including at least one manifold plate to direct ink to an aperture plate forming an exterior surface of the second set of plates, and a polymer compliant film arranged in between the first and second sets of plates to attach the first and second sets of plates together to form the fluid dispensing subassembly.

Abstract: An inkjet array has been developed that enables inlets for one group of inkjet ejectors to be laterally offset from the nozzles of the inkjet ejectors in the group and also enables inlets for another group of inkjet ejectors to be laterally offset from the nozzles of the inkjet ejectors in the other group. The lateral offset distance increases the distance between the inlets of the two groups to provide a wider bonding area between the two groups and improve the fluidic isolation between the two groups of inkjet ejectors.

Abstract: Material transport systems including a radiation-resistant transport belt and methods of cutting substrates transported in the material transport systems are provided. An exemplary material transport system includes a continuous transport belt entrained on at least a first roll and a second roll. The transport belt includes at least a first layer and a second layer over the first layer. The first layer includes an inner surface of the transport belt and the second layer includes an outer surface of the transport belt. The second layer can be comprised of copper, copper-based alloys, aluminum, aluminum-based alloys or nickel.