Patents by Inventor John R. Bray

John R. Bray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connector between die pad and z-interconnect for stacked die assemblies
    Patent number: 9508689
    Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: November 29, 2016
    Assignee: Invensas Corporation
    Inventors: Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, De Ann Eileen Melcher, Keith L. Barrie, Grant Villavicencio, Elmer M. Del Rosario, John R. Bray
  • ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED DIE ASSEMBLIES
    Publication number: 20160027761
    Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.
    Type: Application
    Filed: September 30, 2015
    Publication date: January 28, 2016
    Applicant: INVENSAS CORPORATION
    Inventors: Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, De Ann Eileen Melcher, Keith L. Barrie, Grant Villavicencio, Elmer M. Del Rosario, John R. Bray
  • Electrical connector between die pad and z-interconnect for stacked die assemblies
    Patent number: 9153517
    Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: October 6, 2015
    Assignee: Invensas Corporation
    Inventors: Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, DeAnn Eileen Melcher, Keith L. Barrie, Grant Villavicencio, Elmer M. del Rosario, John R. Bray
  • Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies
    Publication number: 20120119385
    Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.
    Type: Application
    Filed: May 17, 2011
    Publication date: May 17, 2012
    Applicant: VERTICAL CIRCUITS, INC.
    Inventors: Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, DeAnn Elleen Melcher, Keith L. Barrie, Grant Villavicencio, Elmer M. del Rosario, John R. Bray