Abstract: A method of performing a function on a three-dimensional semiconductor chip package as well as on individual chips in the package is disclosed. That method involves the creation of an operative relationship between a function performer and an edge feature on the chip or chips wherein the edge feature consists of one or more of an electrically conductive pad, thermally conductive pad, a probe pad, a fuse, a resistor, a capacitor, an inductor, an optical emitter, an optical receiver, a test pad, a bond pad, a contact pin, a heat dissipator, an alignment marker, a metrology feature and a function performer may be any one or more of a test probe, the laser, a programming device, an interrogation device, a loading device or a tuning device. In addition, a chip per se with edge features is disclosed along with a three-dimensional stack of such chips in either of several different configurations.

Abstract: There is disclosed a method of fabricating an optical waveguiding surface layer in an optically transparent crystalline substrate, such as lithium niobate, by selectively indiffusing metal ions, such as titanium, into the crystal to effect an increase in the index of refraction of a surface portion thereof. The indiffused metal ions serve to raise both the ordinary and extraordinary refractive indices of the substrate by amounts which are of the order of one percent at the diffusion surface and which gradually decrease by one-half at depths of the order of one micrometer below the surface. By properly adjusting the relevant diffusion parameters in the method, the important surface waveguide characteristics can be independently controlled.