Abstract: A system and method for slowing a vehicle. Road conditions around the vehicle are monitored, and determined if those road conditions are hazardous. An engine control unit is informed of the hazardous road conditions and alters the operation of the engine control unit in response to the hazardous road conditions. When an operator of the vehicle desires to slow the vehicle down, an indication is received indicating the intent to slow the vehicle down. The vehicle is then slowed based upon the altered operation of the engine control unit by applying a vacuum to increase a manifold vacuum of the engine.

Abstract: An infrared sensor positioned in a reflow oven includes a reflow oven and a first IR sensor turret suspended over a conveyor surface of the reflow oven, where a directional movement of the first IR sensor turret matches a directional movement of the conveyor surface. A method for managing the IR sensor turret positioned in a reflow oven includes locating, by a first IR sensor turret, a point of interest on a PCBA, where the PCBA is positioned on a conveyor in a reflow oven. The method further includes tracking, by the first IR sensor turret, the point of interest on the PCBA, where the PCBA is moving along the conveyor in the reflow oven. The method further includes capturing, by the first IR sensor turret, a first set of thermal data at the point of interest for a first subarea of the reflow oven.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Abstract: A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.

Abstract: A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

Abstract: An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.

Abstract: A method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. The method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.

Abstract: Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

Abstract: A controlled extraction of an electronic connector from an electronic circuit board includes a press mechanism of a device positioned in spaced relation over a base fixture of the device. The base fixture receiving an electronic circuit board which includes a connector. Shafts of a removal tool of the press mechanism can be inserted into a series of openings in the connector, respectively, in response to applying a downward force to the press mechanism. A capturing element on each of the shafts can be actuated where the capturing element couples to a wall defining the opening of each of the openings. The connector can be removed from the electronic circuit board by applying an upward force to the press mechanism which removes the connector with the capturing element of the shafts coupled to the wall of the opening, and releasing the press mechanism from the base fixture.

Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

Abstract: Described are techniques for quality analysis using thermographic imaging. In one example, a system including a test chamber for receiving an unpowered component. The system further includes an external heat source for heating the unpowered component for a predetermined period of time. The system further includes a thermographic imaging system for collecting thermographic images of the unpowered component during the predetermined period of time. The system further includes a computer communicatively coupled to the thermographic imaging system and configured to classify a quality of the unpowered component based on the thermographic images of the unpowered component.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: A method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. The method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.

Abstract: A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

Abstract: A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.

Abstract: A voltage source watchdog comprising a passive device is placed in series between a voltage source and a load. The passive device includes an electromigration (EM) joint of known materials that will create an electromigration void after a specified amount of current passes through the EM joint. After a known amount of current as passed through, a void is created and a voltage will no longer be sensed, thus providing a sure safety mode situation. When the voltage source is a battery, the battery life may be extended by selectively enabling voltage measurement operations for the proposed watchdog.