Abstract: An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU in/(hr ft2° F.); wherein the pressure sensitive adhesive on the major surface of the film adheres to the substrate. Application devices and kits that may be used in conjunction with the method are also disclosed herein.

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract: An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU/hr-in-ft2-° F.; wherein the pressure sensitive adhesive on the major surface of the film adheres to the substrate. Application devices and kits that may be used in conjunction with the method are also disclosed herein.

Abstract: An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU in /(hr ft2 °F.); wherein the pressure sensitive adhesive on the major surface of the film adheres to the substrate. Application devices and kits that may be used in conjunction with the method are also disclosed herein.

Abstract: An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU/hr-in-ft2-° F.; wherein the pressure sensitive adhesive on the major surface of the film adheres to the substrate. Application devices and kits that may be used in conjunction with the method are also disclosed herein.

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract: An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU/hr-in-ft2-° F.; wherein the pressure sensitive adhesive on the major surface of the film adheres to the substrate. Application devices and kits that may be used in conjunction with the method are also disclosed herein.

Abstract: An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU/hr-in-ft2-° F.; wherein the pressure sensitive adhesive on the major surface of the film adheres to the substrate. Application devices and kits that may be used in conjunction with the method are also disclosed herein.

Abstract: A lighting element that includes a hollow enclosure, an optical lighting film, reflective interior surfaces, and a partially collimating light source is described. The lighting element can be used as a light block for illuminating light boxes, sign boxes, or luminaries. The lighting element can be rectangular in shape, thin, bright, uniform, energy efficient and lightweight, and can be configured to emit light from one or opposing surfaces. Additional light management elements, such as diffusing films, graphic films and information displays, can be positioned adjacent to the output surface(s) of the lighting element for a variety of applications. Several lighting elements can be tiled together to light larger areas and larger signs.

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract: A lighting element that includes a hollow enclosure, an optical lighting film, reflective interior surfaces, and a partially collimating light source is described. The lighting element can be used as a light block for illuminating light boxes, sign boxes, or luminaires. The lighting element can be rectangular in shape, thin, bright, uniform, energy efficient and lightweight, and can be configured to emit light from one or opposing surfaces. Additional light management elements, such as diffusing films, graphic films and information displays, can be positioned adjacent to the output surface(s) of the lighting element for a variety of applications. Several lighting elements can be tiled together to light larger areas and larger signs.

Abstract: The present application is related to substrates having light transmitting areas and light shielding areas. The application discloses methods of manufacturing the substrates, including modifying a light shielding layer be contact to a structured surface.

Abstract: An LED backlight assembly is disclosed. The assembly includes a housing having a plurality of internal surfaces. At least one of the internal surfaces is a light emission surface and an opposing surface is a reflective surface. An optical film is disposed between the light emission surface and the reflective surface. The optical film includes at least one of a diffusing film, a reflective polarizing film, a multilayer optical film, and a structured surface film. An array of LEDs in electrical communication is disposed on the optical film. At least one LED of the array of LEDs has an illumination field that is directed toward the reflective surface.

Abstract: The present application is directed to a method of producing a multilayer circuit. The method comprises providing a first electrically insulating layer comprising apertures through the layer and bonding the first electrically insulating layer with a first conductive layer. The first conductive layer is bonded to the first electrically insulating layer in register to the apertures in the electrically insulating layer and the multilayer circuit is produced at a sustained rate. In another embodiment, the method comprises providing a second electrically insulating layer and bonding the second electrically insulating layer with the first conductive layer opposite the first electrically insulating layer.

Abstract: The present invention provides adhesive film removal methods and apparatus. The removal methods and apparatus involve apply tension over the width of the adhesive film, thereby removing the film from the substrate along the release line that extends over the width of the film. The methods and apparatus are particularly useful in removing large-scale graphic films from substrates such as truck trailers, vans, walls, signs and other large surfaces. The tension applied to the adhesive film during removal is preferably uniform across the width of the film, thereby reducing the risk of the film tearing or breaking during removal. The release line is advanced during removal along the length of the film until the entire film is removed from the substrate.

Abstract: An LED backlight assembly is disclosed. The assembly includes a housing having a plurality of internal surfaces. At least one of the internal surfaces is a light emission surface and an opposing surface is a reflective surface. An optical film is disposed between the light emission surface and the reflective surface. The optical film includes at least one of a diffusing film, a reflective polarizing film, a multilayer optical film, and a structured surface film. An array of LEDs in electrical communication is disposed on the optical film. At least one LED of the array of LEDs has an illumination field that is directed toward the reflective surface.