Patents by Inventor John R. Fisher, Jr.

John R. Fisher, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4558812
    Abstract: Chip carriers (10--10) are released from an end of a dispensing means (38) drawn across a holder (22) having a plurality of apertures (28--28) therein, to place a carrier in each aperture. Small solder spheres (58--58) are located in a plurality of dimples (56--56) of a planar plate (40) in arrays that are substantially the same as a plurality of bonding pad arrays (18--18) on the bottom surface of a plurality of chip carriers. A vacuum is applied to the holder (22) to hold the chip carriers (10--10) in the apertures (28--28) as the holder rotates to place the bonding pads (18--18) in contact with the solder spheres (68--68). The solder spheres (58--58) are reflowed by applying heat to form a solder "bump" (68) on each pad (18). The chip carriers (10--10) are then cooled and loaded into a plurality of the tubular members (39--39).
    Type: Grant
    Filed: November 7, 1984
    Date of Patent: December 17, 1985
    Assignee: AT&T Technologies, Inc.
    Inventors: Alred S. Bailey, John R. Fisher, Jr.
  • Patent number: 4412642
    Abstract: The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier, protecting the underlying circuitry, and accounting for stresses which may develop due to thermal mismatch between the chip carrier and the board, and to board flexure. Herein disclosed is a lead (15) for semiconductor chip carriers comprising an elongated body of high melting point electrically conductive material, e.g., solder material. Also disclosed is a method for casting such a solder lead, and a method for attaching a plurality of cast solder leads (38) to a leadless chip carrier (20).
    Type: Grant
    Filed: March 15, 1982
    Date of Patent: November 1, 1983
    Assignee: Western Electric Co., Inc.
    Inventor: John R. Fisher, Jr.