Abstract: A fluid pressure transducer assembly (10) includes an exemplary silicon or ceramic capacitive transducer (22) having a relatively flexible diaphragm portion (22e) mounted on a ceramic substrate or circuit board (18) over a bore (18a) so that the diaphragm is exposed to fluid pressure from a port (12m) received through the bore. The circuit board is received in a plastic housing (12) laterally positioned by guides (12e, 12f) on three height control pins (12d) to vertically position the circuit board a defined, precise distance above a platform (12b) on which a bead of adhesive sealing material has previously been placed, the sealing material having a height greater than the distance between a plane in which the free end of the height control pins lie and a plane in which the top surface of the platform lies. As a result, the circuit board is sealed to the plastic housing through a bead having a uniform, precise height all around its circumference to isolate temperature expansion stresses.