Patents by Inventor John R. Gonzalez
John R. Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12160035Abstract: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.Type: GrantFiled: April 25, 2023Date of Patent: December 3, 2024Assignee: Pacesetter, Inc.Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
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Publication number: 20240366932Abstract: A method for fabricating a neurostimulation stimulation lead includes providing a plurality of ring components and hypotubes. An insulative coating is disposed on at least one of (i) inner surfaces of the ring components or (ii) the hypotubes. The method includes welding the hypotubes to the inner surfaces of the ring components, and molding an insulative material to fill interstitial spaces between the ring components and the hypotubes that are welded to form a stimulation tip component of the stimulation lead. The method includes forming segmented electrodes from the ring components after performing the molding.Type: ApplicationFiled: July 16, 2024Publication date: November 7, 2024Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
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Patent number: 12064617Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.Type: GrantFiled: May 12, 2021Date of Patent: August 20, 2024Assignee: ADVANCED NEUROMODULATION SYSTEMS, INC.Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
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Publication number: 20230261368Abstract: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.Type: ApplicationFiled: April 25, 2023Publication date: August 17, 2023Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
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Patent number: 11670843Abstract: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.Type: GrantFiled: October 27, 2021Date of Patent: June 6, 2023Assignee: Pacesetter, Inc.Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
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Publication number: 20220088375Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.Type: ApplicationFiled: December 6, 2021Publication date: March 24, 2022Inventors: John R. Gonzalez, Jeffrey Urbanski, Tommy Cushing
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Publication number: 20220052448Abstract: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.Type: ApplicationFiled: October 27, 2021Publication date: February 17, 2022Applicant: Pacesetter, Inc.Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
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Patent number: 11191952Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.Type: GrantFiled: February 18, 2019Date of Patent: December 7, 2021Assignee: PACESETTER, INC.Inventors: John R. Gonzalez, Jeffrey Urbanski, Tommy Cushing
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Patent number: 11189915Abstract: Disclosed herein is an implantable electronic device including a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly includes an antenna including a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly includes one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.Type: GrantFiled: January 27, 2020Date of Patent: November 30, 2021Assignee: Pacesetter, Inc.Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
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Publication number: 20210260367Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.Type: ApplicationFiled: May 12, 2021Publication date: August 26, 2021Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
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Patent number: 11033733Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.Type: GrantFiled: March 12, 2019Date of Patent: June 15, 2021Assignee: ADVANCED NEUROMODULATION SYSTEMS, INC.Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
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Publication number: 20200161750Abstract: Disclosed herein is an implantable electronic device including a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly includes an antenna including a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly includes one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.Type: ApplicationFiled: January 27, 2020Publication date: May 21, 2020Applicant: Pacesetter, Inc.Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
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Patent number: 10587038Abstract: Disclosed herein is an implantable electronic device having a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly has an antenna with a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly has one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.Type: GrantFiled: June 26, 2017Date of Patent: March 10, 2020Assignee: Pacesetter, Inc.Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
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Publication number: 20190209832Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.Type: ApplicationFiled: March 12, 2019Publication date: July 11, 2019Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
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Publication number: 20190175905Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.Type: ApplicationFiled: February 18, 2019Publication date: June 13, 2019Inventors: John R. Gonzalez, Jeffrey Urbanski, Tommy Cushing
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Patent number: 10226619Abstract: In one embodiment, a neurostimulation lead comprises: a lead body comprising a plurality of conductor wires; and a molded stimulation tip end comprising a plurality of segmented electrodes, hypotubes, and an annular frame structure: wherein (i) each segmented electrode of the plurality of segmented electrodes has an inner surface, an outer surface, and step-down region embedded within polymer material of the molded stimulation tip end, (ii) each respective hypotube is directly welded to the inner surface of a corresponding segmented electrode of the plurality of segmented electrodes.Type: GrantFiled: May 24, 2016Date of Patent: March 12, 2019Assignee: ADVANCED NEUROMODULATION SYSTEMS, INC.Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
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Patent number: 10207119Abstract: Implementations described and claimed herein provide implantable electronic devices having a thin film feedthrough and methods of manufacturing the same. In one implementation, an implantable electronic device includes a housing enclosing one or more internal electronic components within a hermetic environment. A feedthrough port is defined in a wall of the housing. A thin film feedthrough has a feedthrough body extending through the feedthrough port. The feedthrough body provides one or more electrical pathways between external contacts and internal contacts. The external contacts are disposed outside the hermetic environment, and the internal contacts are electrically connected to the one or more internal electronic components at an internal connection junction. A hermetic junction is disposed in the feedthrough port isolating the thin film feedthrough from the housing.Type: GrantFiled: March 21, 2017Date of Patent: February 19, 2019Assignee: PACESETTER, INC.Inventors: Jeffrey Urbanski, Theodore Alfonso, John R. Gonzalez
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Patent number: 10207103Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.Type: GrantFiled: September 14, 2016Date of Patent: February 19, 2019Assignee: PACESETTER, INC.Inventors: John R. Gonzalez, Jeffrey Urbanski, Tommy Cushing
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Publication number: 20180169417Abstract: Implementations described and claimed herein provide implantable electronic devices having a thin film feedthrough and methods of manufacturing the same. In one implementation, an implantable electronic device includes a housing enclosing one or more internal electronic components within a hermetic environment. A feedthrough port is defined in a wall of the housing. A thin film feedthrough has a feedthrough body extending through the feedthrough port. The feedthrough body provides one or more electrical pathways between external contacts and internal contacts. The external contacts are disposed outside the hermetic environment, and the internal contacts are electrically connected to the one or more internal electronic components at an internal connection junction. A hermetic junction is disposed in the feedthrough port isolating the thin film feedthrough from the housing.Type: ApplicationFiled: March 21, 2017Publication date: June 21, 2018Inventors: Jeffrey Urbanski, Theodore Alfonso, John R. Gonzalez
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Publication number: 20180131085Abstract: Disclosed herein is an implantable electronic device having a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly has an antenna with a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly has one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.Type: ApplicationFiled: June 26, 2017Publication date: May 10, 2018Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Cook