Patents by Inventor John R. Gonzalez

John R. Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210260367
    Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
  • Patent number: 11033733
    Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: June 15, 2021
    Assignee: ADVANCED NEUROMODULATION SYSTEMS, INC.
    Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
  • Publication number: 20200161750
    Abstract: Disclosed herein is an implantable electronic device including a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly includes an antenna including a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly includes one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.
    Type: Application
    Filed: January 27, 2020
    Publication date: May 21, 2020
    Applicant: Pacesetter, Inc.
    Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
  • Patent number: 10587038
    Abstract: Disclosed herein is an implantable electronic device having a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly has an antenna with a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly has one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: March 10, 2020
    Assignee: Pacesetter, Inc.
    Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Crook
  • Publication number: 20190209832
    Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.
    Type: Application
    Filed: March 12, 2019
    Publication date: July 11, 2019
    Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
  • Publication number: 20190175905
    Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.
    Type: Application
    Filed: February 18, 2019
    Publication date: June 13, 2019
    Inventors: John R. Gonzalez, Jeffrey Urbanski, Tommy Cushing
  • Patent number: 10226619
    Abstract: In one embodiment, a neurostimulation lead comprises: a lead body comprising a plurality of conductor wires; and a molded stimulation tip end comprising a plurality of segmented electrodes, hypotubes, and an annular frame structure: wherein (i) each segmented electrode of the plurality of segmented electrodes has an inner surface, an outer surface, and step-down region embedded within polymer material of the molded stimulation tip end, (ii) each respective hypotube is directly welded to the inner surface of a corresponding segmented electrode of the plurality of segmented electrodes.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: March 12, 2019
    Assignee: ADVANCED NEUROMODULATION SYSTEMS, INC.
    Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
  • Patent number: 10207103
    Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: February 19, 2019
    Assignee: PACESETTER, INC.
    Inventors: John R. Gonzalez, Jeffrey Urbanski, Tommy Cushing
  • Patent number: 10207119
    Abstract: Implementations described and claimed herein provide implantable electronic devices having a thin film feedthrough and methods of manufacturing the same. In one implementation, an implantable electronic device includes a housing enclosing one or more internal electronic components within a hermetic environment. A feedthrough port is defined in a wall of the housing. A thin film feedthrough has a feedthrough body extending through the feedthrough port. The feedthrough body provides one or more electrical pathways between external contacts and internal contacts. The external contacts are disposed outside the hermetic environment, and the internal contacts are electrically connected to the one or more internal electronic components at an internal connection junction. A hermetic junction is disposed in the feedthrough port isolating the thin film feedthrough from the housing.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: February 19, 2019
    Assignee: PACESETTER, INC.
    Inventors: Jeffrey Urbanski, Theodore Alfonso, John R. Gonzalez
  • Publication number: 20180169417
    Abstract: Implementations described and claimed herein provide implantable electronic devices having a thin film feedthrough and methods of manufacturing the same. In one implementation, an implantable electronic device includes a housing enclosing one or more internal electronic components within a hermetic environment. A feedthrough port is defined in a wall of the housing. A thin film feedthrough has a feedthrough body extending through the feedthrough port. The feedthrough body provides one or more electrical pathways between external contacts and internal contacts. The external contacts are disposed outside the hermetic environment, and the internal contacts are electrically connected to the one or more internal electronic components at an internal connection junction. A hermetic junction is disposed in the feedthrough port isolating the thin film feedthrough from the housing.
    Type: Application
    Filed: March 21, 2017
    Publication date: June 21, 2018
    Inventors: Jeffrey Urbanski, Theodore Alfonso, John R. Gonzalez
  • Publication number: 20180131085
    Abstract: Disclosed herein is an implantable electronic device having a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly has an antenna with a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly has one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.
    Type: Application
    Filed: June 26, 2017
    Publication date: May 10, 2018
    Inventors: Armando M. Cappa, Jorge N. Amely-Velez, Alan B. Vogel, Wisit Lim, John R. Gonzalez, Alexander Robertson, Alex Soriano, Evan Sheldon, Perry Li, Jeffery Cook
  • Publication number: 20180008821
    Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.
    Type: Application
    Filed: September 14, 2016
    Publication date: January 11, 2018
    Inventors: John R. Gonzalez, Jeffrey Urbanski, Tommy Cushing
  • Publication number: 20160263370
    Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.
    Type: Application
    Filed: May 24, 2016
    Publication date: September 15, 2016
    Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
  • Patent number: 9370653
    Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: June 21, 2016
    Assignee: ADVANCED NEUROMODULATION SYSTEMS, INC.
    Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
  • Publication number: 20150157851
    Abstract: In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.
    Type: Application
    Filed: November 14, 2014
    Publication date: June 11, 2015
    Inventors: Ryan Sefkow, Christopher A. Crawford, Jeffrey Mitchell, Kevin Wilson, Raymond P. Bray, John R. Gonzalez
  • Patent number: 4723061
    Abstract: A flux cored welding electrode for use in electric arc welding with a shielded gas, which electrode includes a tube of low carbon steel having on the inside thereof a titanium dioxide based flux with fluxing ingredients including aluminum oxide in the amount of 0.1 to 0.5% of the total weight of the electrode. The improvement of the invention wherein the titanium dioxide based flux with aluminum oxide free of magnesium or compounds of magnesium.
    Type: Grant
    Filed: July 31, 1986
    Date of Patent: February 2, 1988
    Assignee: The Lincoln Electric Company
    Inventors: Robert P. Munz, John R. Gonzalez, Ronald J. Gordish