Patents by Inventor John R. Hugill

John R. Hugill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Gateless injection mold for encapsulating semiconductor devices
    Patent number: 4003544
    Abstract: In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.
    Type: Grant
    Filed: March 24, 1975
    Date of Patent: January 18, 1977
    Assignee: Motorola, Inc.
    Inventors: Thomas G. Bliven, John R. Hugill
  • Combination strip frame for semiconductive device and gate for molding
    Patent number: 3950140
    Abstract: In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.
    Type: Grant
    Filed: February 18, 1975
    Date of Patent: April 13, 1976
    Assignee: Motorola, Inc.
    Inventors: Thomas G. Bliven, John R. Hugill