Patents by Inventor John R. Kochilla
John R. Kochilla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110206844Abstract: A process for passivating a vapor-deposited aluminum layer on a substrate, including providing a substrate comprising vapor deposited aluminum on a surface thereof; treating the surface of the substrate with an aqueous substantially chromium-free composition comprising a hexafluorozirconate; and rinsing the treated surface with water. A process for passivating a vapor-deposited aluminum layer on a substrate, including vapor depositing a layer of aluminum on a substrate; treating the substrate with the vapor deposited aluminum with an aqueous substantially chromium-free composition comprising a hexafluorozirconate; and rinsing the treated substrate with water.Type: ApplicationFiled: February 24, 2010Publication date: August 25, 2011Inventors: Jacob Grant Wiles, John R. Kochilla
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Patent number: 7101469Abstract: A metal piece having an organic coating with improved corrosion resistance and adhesion is described which comprises a zinc or zinc alloy plated metal piece having on its surface, a chromate film deposited from an aqueous acidic chromium solution comprising trivalent chromium as substantially the only chromium ion present, and a cathodic electrocoated siccative organic coating on the chromate film. A process for obtaining such coated metal pieces also is described.Type: GrantFiled: November 10, 2004Date of Patent: September 5, 2006Assignee: Atotech Deutschland GmbHInventors: John R. Kochilla, Morgan Bishop, William B. Staples
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Patent number: 6720499Abstract: A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.Type: GrantFiled: November 1, 2001Date of Patent: April 13, 2004Assignee: Atotech Deutschland GmbHInventors: George S. Bokisa, Craig V. Bishop, John R. Kochilla
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Patent number: 6602440Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: GrantFiled: August 13, 2001Date of Patent: August 5, 2003Assignee: Atotech Deutschland GmbHInventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Patent number: 6579591Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: GrantFiled: July 17, 2001Date of Patent: June 17, 2003Assignee: Atotech Deutschland GmbHInventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Publication number: 20020064676Abstract: A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.Type: ApplicationFiled: November 1, 2001Publication date: May 30, 2002Inventors: George S. Bokisa, Craig V. Bishop, John R. Kochilla
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Publication number: 20020056702Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: ApplicationFiled: August 13, 2001Publication date: May 16, 2002Inventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Publication number: 20020048685Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: ApplicationFiled: July 17, 2001Publication date: April 25, 2002Inventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Patent number: 6361823Abstract: A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt.Type: GrantFiled: December 3, 1999Date of Patent: March 26, 2002Assignee: Atotech Deutschland GmbHInventors: George S. Bokisa, Craig V. Bishop, John R. Kochilla
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Patent number: 6284309Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: GrantFiled: December 19, 1997Date of Patent: September 4, 2001Assignee: Atotech Deutschland GmbHInventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Patent number: 6086779Abstract: This invention relates to an aqueous etching composition for etching metallic copper comprising(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition.The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.Type: GrantFiled: March 1, 1999Date of Patent: July 11, 2000Assignee: McGean-Rohco, Inc.Inventors: Craig V. Bishop, John R. Kochilla, Robert J. Durante, George S. Bokisa