Abstract: An envelope apparatus is provided for facilitating the production of a vacuum at a localized region on the surface of an article such as a semiconductor wafer. The vacuum permits vacuum processing in the localized region. The envelope apparatus includes an internal processing zone in which the requisite processing level vacuum is maintained. The envelope apparatus also includes intermediate vacuum zones surrounding the internal processing zone. The internal processing zone and surrounding intermediate vacuum zones are exposed at an external surface so that when the external surface is placed in spaced apart, close coupled opposition to the article being processed a graded vacuum seal is formed. The graded seal extends from the internal processing zone, past the intermediate vacuum zones and out to ambient.