Abstract: A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.

Abstract: A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.

Abstract: A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.

Abstract: A detailing tool for processing electronic component substrate includes a supporting frame, a substrate carrier movable on the supporting frame to receive and secure the substrate during processing by the tool, and a pair of cutter assembly attached to said supporting frame for removing tails on said substrate. The cutter assemblies self-align “to” the substrate during initial substrate loading in a processing area of the tool. Each cutter assembly includes a pair of spaced, translatable and opposed cutters that simultaneously move towards each another while removing the tails from the corners of the substrate that remains stationary. The pair of cutter assemblies are symmetrically attached to the supporting frame with respect to an axis for indexing the substrate. Thus, the invention provides a tool for cutting tails from opposite corners on the substrate edge automatically and simultaneously during processing.

Abstract: A detailing tool for processing electronic component substrate includes a supporting frame, a substrate carrier movable on the supporting frame to receive and secure the substrate during processing by the tool, and a pair of cutter assembly attached to said supporting frame for removing tails on said substrate. The cutter assemblies self-align “to” the substrate during initial substrate loading in a processing area of the tool. Each cutter assembly includes a pair of spaced, translatable and opposed cutters that simultaneously move towards each another while removing the tails from the corners of the substrate that remains stationary. The pair of cutter assemblies are symmetrically attached to the supporting frame with respect to an axis for indexing the substrate. Thus, the invention provides a tool for cutting tails from opposite corners on the substrate edge automatically and simultaneously during processing.

Abstract: Disclosed is a flexible sheet handling apparatus including a frame having a vacuum passage located around the periphery of the frame. There is also a porous, polymeric plug which covers the vacuum passage. When a vacuum is applied to the vacuum passage and the porous, polymeric plug, a flexible sheet in contact with the porous, polymeric plug is uniformly held only around the periphery of the flexible sheet by the applied vacuum.

Abstract: A green sheet holding apparatus includes a first member secured to a first edge of the green sheet and a second member moveable relative to the first member, the second member being secured to a second edge of the green sheet. A forcing mechanism, connected to the second member and to the first member, forces the second member away from the first member such that the first edge and the second edge of the green sheet are forced away from each other and the green sheet is flattened. The holding apparatus may be included in a green sheet inspection system, wherein the inspection system further includes a light source directing a light onto the green sheet and a camera detecting light from the green sheet. The invention also includes a method of holding a green sheet, which includes securing the first edge of the green sheet to a first member, securing the second edge of the green sheet to a second member, and forcing the second member away from the first member.

Abstract: Disclosed is a method for reducing screening defects on ceramic greensheets which includes placing additional vias in the kerf that will be eventually discarded during the sizing operation. Also disclosed is a ceramic substrate laminate article with reduced screening defects.

Abstract: A method for serializing ceramic substrates in which a laser is used to remove unfired paste material from an unfired ceramic substrate. The paste material is removed by exposing the unwanted paste material to laser radiation in a programmed sequence of x and y coordinate moves. The laser radiation removes the unwanted paste material, leaving the identifying characters intact. The identifying characters can be used for part identification and traceability.

Abstract: An article handler having a plurality of compartments in a frame with each compartment having a plurality of ribs extending across the compartments. The ribs in adjacent compartments extend perpendicularly to each other to provide resistance against warping of the frame in both directions, thereby maintaining the frame flat. The compartments are covered by filters. Suction is distributed throughout each compartment. When the filters are positioned in proximity to articles, the suction in the compartments is effective to lift the articles.

Abstract: A laser ablation mask repair method. Defects (holes) are located in a dielectric mask. The surface of the mask above the defect is melted with a CO.sub.2 laser to form a depression in the surface. The depression forms a lens which diffuses ablation laser energy instead of transmitting it. Thus, the ablation laser is prevented from ablating a polymer ablation layer, because the holes are blocked and, the mask is repaired. The method may also be used to make Engineering Changes (EC) laser ablation masks.

Abstract: A method of patterning a preimidized benzophenone photoactive polymer used as a photoresist with a laser light source improves its crosslinking efficiency and reduces swelling, thereby enabling the formation of lines on the order of microns.

Abstract: Control of the local environment during pulsed laser removal of thin film circuit metallurgy is used to change the nature of the top surfaces. Interconnecting such laser treated surfaces with LCVD films results in different growth morphologies, dependent on the nature of the surface created and the debris generated during the ablation process. Flowing helium across the surface during the ablation process results in improved growth morphologies for the same laser writing conditions. A low power laser scan is used to induce metal deposition on the substrate without surface damage. This is followed by several scans at an intermediate laser power to deposit the desired thickness of metal (e.g., about 8 .mu.m). Lastly, a high power laser scan is used, either at the points of intersection between the existing metallurgy and the metal repair or across the entire deposit area. Thermal spreading or blooming is reduced by modulating the intensity of the laser source.

Abstract: The present invention is a mask and methods for making masks for use with a laser projection etching system. The unique mask is able to withstand the fluences of the high energy and high power lasers used without degrading. Specifically, the new projection etching masks are fabricated of patterned multiple dielectric layers having alternating high and low indices of refraction on a UV grade synthetic fused silica substrate in order to achieve maximum reflectivity of the laser energy in the opague areas and maximum transmissivity of the laser energy in the transparent areas of the mask.

Abstract: A method for etching a polyimide body which involves directing U.V. radiation having a wavelength between about 240 to 400 nm. onto the body is described. The radiation is continued to be applied to the body for sufficient time to cause a direct etching of the body where the radiation impinges upon the body. The method is particularly useful where the U.V. radiation is passed through a mask located between the source of the ultraviolet radiation and the body so that a radiation pattern is projected onto the body where the direct etching takes place. The etching can be caused to produce openings having a positive slope in the radiation pattern upon the polyimide layer. The advantage of the positive slope is particularly great where a coating such as a metal layer is deposited over the remaining polyimide layer having the openings therein. The positive slope allows the complete filling of the openings.

Abstract: Disclosed is a method of etching a metallized substrate by excimer laser radiation. The substrate is exposed to a selected gas, e.g., a halogen gas, which spontaneously reacts with the metal forming a solid reaction product layer on the metal by a partial consumption of the metal. A beam of radiation from an excimer laser, e.g. XeF laser operating at a wavelength of 351 nm or XeCl laser at 308 nm or KrF laser at 248 nm or KrCl laser at 222 nm or ArF laser at 193 nm or F.sub.2 laser at 157 nm, is applied to the reaction product in a desired pattern to vaporize the reaction product and thereby selectively etch the metal with a high resolution.

Abstract: An intense broadband continuum light pulse of uniform spectral intensity and short time duration is generated. This continuum pulse is then downconverted in frequency to a region of interest, preferably in the infrared region, by applying it as a pump pulse to a molecular or atomic vapor so as to induce stimulated Raman scattering. The resulting Raman Stokes pulse surprisingly tends to have the same spectral bandwidth, intensity uniformity and time duration as the pump continuum pulse.The downconverted continuum pulse (the Raman Stokes pulse) is then used to probe a sample. The sample converts the uniform spectral intensity distribution of the probe pulse into a nonuniform spectral intensity distribution which contains the absorption spectrum of the sample. This spectrum pulse has the same spectral bandwidth and time duration as the Raman Stokes pulse and is finally upconverted in frequency to a region where the spectrum pulse can be conveniently recorded.