Patents by Inventor John R. Lovie

John R. Lovie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Palladium and palladium alloy plating
    Patent number: 4715935
    Abstract: The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diamino oxalate, (Pd(NH.sub.3).sub.2 C.sub.2 O.sub.4), palladium tetraamino oxalate (Pd(NH.sub.3).sub.4 C.sub.2 O.sub.4) or an ammonium or alkali metal salt of palladium dioxalate (M.sub.2 Pd(C.sub.2 O.sub.4)).sub.2), where M represents an ammonium or alkali metal cation.Alloying metal ions may also be present, as may an electrolyte, a brightener and/or a stress reducer.
    Type: Grant
    Filed: January 21, 1986
    Date of Patent: December 29, 1987
    Assignee: OMI International Corporation
    Inventors: John R. Lovie, Gerardus A. Somers, Jan J. M. Hendriks
  • Gold alloy plating bath and process
    Patent number: 4615774
    Abstract: A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.
    Type: Grant
    Filed: January 31, 1985
    Date of Patent: October 7, 1986
    Assignee: OMI International Corporation
    Inventors: Gerardus A. Somers, John R. Lovie, Jan J. M. Hendriks