Patents by Inventor John R. Mankus

John R. Mankus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5530291
    Abstract: An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages fully assemble. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: June 25, 1996
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa
  • Patent number: 5468996
    Abstract: An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: November 21, 1995
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa
  • Patent number: 4927387
    Abstract: A method and connector device for connecting insulated wire cable to another device is provided. The connector device includes a housing having an array of bifurcated connector disposed in a preselected pattern. The cable wires are completely stripped of the insulation at locations corresponding to the pattern of the connectors. The wires are then pushed into the connectors transversely to slidingly and frictionally engage the wires. The wires are pushed into this engagement by a cover which coacts with the housing to insulate the wires and their connectors.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: May 22, 1990
    Assignee: International Business Machines Corporation
    Inventors: Donald F. Eckler, John R. Mankus, Francis J. Ripp, George J. Saxenmeyer Jr.