Abstract: An electronic device may include a housing, a first printed circuit board (PCB) carried by the housing and radio frequency (RF) circuitry on the PCB, and an RF filter module carried by the PCB. The RF filter module may include a second PCB carried by the first PCB, a plurality of first coaxial resonators arranged in side-by-side relation on the second PCB, and at least one second coaxial resonator stacked on the plurality of first coaxial resonators, and interconnect circuitry coupling the plurality of first coaxial resonators and the at least one second coaxial resonator to the second PCB.

Abstract: An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.

Abstract: An electronic device may include a housing, a first printed circuit board (PCB) carried by the housing and radio frequency (RF) circuitry on the PCB, and an RF filter module carried by the PCB. The RF filter module may include a second PCB carried by the first PCB, a plurality of first coaxial resonators arranged in side-by-side relation on the second PCB, and at least one second coaxial resonator stacked on the plurality of first coaxial resonators, and interconnect circuitry coupling the plurality of first coaxial resonators and the at least one second coaxial resonator to the second PCB.

Abstract: An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.

Abstract: Wireless transceiver includes a plurality of RF filters. A first band switching network includes a first plurality of RF switches to selectively direct transmitter RF energy to a selected RF filter. A second band switching network includes a second plurality of RF switches which selectively controls which of RF filter is connected to an antenna port. A receiver RF switch is connected to at least one of the RF filters and to a receiver input to selectively permit the received RF energy arriving at one RF filter to be communicated to the receiver. Each RF switch is a PIN diode type with at least one series diode provided along a signal path. No more than two PIN diodes are present in the signal path between the common transmitter port and the common antenna port when any of the RF filters is in use.

Abstract: Wireless transceiver includes a plurality of RF filters. A first band switching network includes a first plurality of RF switches to selectively direct transmitter RF energy to a selected RF filter. A second band switching network includes a second plurality of RF switches which selectively controls which of RF filter is connected to an antenna port. A receiver RF switch is connected to at least one of the RF filters and to a receiver input to selectively permit the received RF energy arriving at one RF filter to be communicated to the receiver. Each RF switch is a PIN diode type with at least one series diode provided along a signal path. No more than two PIN diodes are present in the signal path between the common transmitter port and the common antenna port when any of the RF filters is in use.