Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.

Abstract: A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.

Abstract: A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof with solder. A casing is further formed on the substrate outwardly of the aperture and the heat sink mounted thereacross, the casing being comprised of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted to the heat sink secured therein.

Abstract: An implement is coupled to the forward ends of a pair of loader lift arms through the medium of an attachment assembly comprising a pair of implement carriers respectively vertically pivotally mounted to the pair of loader lift arms by a connector rod that extends through aligned holes provided in lower locations of the carriers, the connector rod being releasably fastened to each of the carriers so that the latter are pivoted in unison by hydraulic cylinders connected between the lift arms and upper locations of the carriers. The attachment assembly further includes a pair of downwardly opening hooks welded to upper locations of the back side of the implement and including arcuate portions respectively receiving cylindrical bars defining upper ends of the pair of carriers. Also fixed to the back side of the implement are a pair of rearwardly projecting, tapered connecting pins that are respectively received in holes provided in mounting plates forming lower forward portions of the carriers.

Abstract: A parking stand for an agricultural loader particularly well suited for use with tractors having mid-mounted mowers or similar tools carried beneath the tractor. The stand includes a pair of legs for each mast, the legs being adapted to fold between a stored position adjacent the mast and a supporting position extending laterally from the mast.

Abstract: Structure for detachably mounting a loader to a tractor or other mobile vehicle. An upright pedestal is carried at the rearward end of each loader boom arm for positioning in a receiving support carried on respective sides of the vehicle. Guide and following surfaces provided between the lower portions of each pedestal and support facilitate quick, positive engagement of the pedestal with its support. A transverse pin at the lower end of each receiving support provides a pivotable support for a downwardly opening bracket which is carried on each pedestal and is guided onto the pin by the guide and following surfaces. Engagement of the bracket on the pin horizontally locates the pedestal relative to the support and vertically positions alignable and releasable fastening structure carried between each pedestal and support.