Patents by Inventor John R. Robichaud

John R. Robichaud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a package for microelectronic devices using iron oxide as a bonding agent
    Patent number: 6261867
    Abstract: A package for a microelectronic device, and a method for making the package, include a thermally conductive base containing a metal composite including a high conductivity metal and a ferrous alloy, the base having a surface with an iron oxide deposit disposed thereon. An insulating substrate is disposed on the surface of the base, the substrate having an aperture formed therein for exposing a portion of the surface of the base for mounting the device on the base. A conductive lead has a portion thereof embedded within the insulating substrate and is adapted to be electrically connected to the device. The insulating substrate is bonded to the iron oxide deposit disposed on the surface of the base, such as by heating.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: July 17, 2001
    Assignee: Stratedge Corporation
    Inventors: John R. Robichaud, Raymond Duff, Donald C. Taber