Abstract: A design is presented for an N×N crossbar switch. A crossbar switch is one of the basic components of Optical Switching Networks. An optical N×N switch has the capability of connecting any light beam from the input of the switch to any output of the switch without interfering with other light beams. That is each single input is connected to one and only one of the output ports without interfering with any other beam or beams. The design presented is based on the use of precision meso-scale mechanics of the size typically found in miniature disc drives and meso-scale optical components. This meso-scale mechanics is then controlled or driven by precision servo-electronics and software to achieve the correct switching. The precision servomechanisms, meso-scale mechanics, electronics and software control are designed to work together to self-compensate for assembly or manufacturing defects and deleterious environmental, including temperature, effects.

Abstract: An ejection system for engaging a transceiver to a host circuit board in a guide rail having a front and back orientation and for ejecting said transceiver from said guide rail, said system comprising: (a) a latching mechanism within said guide rail adapted for latching to a projection extending from a housing of a transceiver when said transceiver is moved backward on said guide rail to an engaging position, thereby preventing said transceiver from moving forward; (b) resilient means within said guide rail adapted for urging said transceiver forward when said transceiver is in said engaging position; and (c) a release mechanism within said card guide and adapted for disengaging said latching mechanism from said projection when said release mechanism is actuated to a releasing position, thereby allowing said resilient means to move said transceiver forward.

Abstract: According to the present invention, an optical waveguide is provided on a silica or silicon substrate using MPACVD and ICP etching processes. Optical fiber is coupled to the waveguide by positioning the fiber in a groove formed in the waveguide and compressing a top lid on the fiber. The top lid is secured to the waveguide and fiber by an epoxy or a solder. In a solder based embodiment, the cladding of the fiber may have a metallization evaporated thereon.

Abstract: An optical connector system comprises mating first and second fiber ferrules (1, 11). Each ferrule (1, 11) has an endface (4, 14) polished at an angle to minimize backreflections. A holographic optical element (6) disposed on the first ferrule endface (4) receives a transmitted beam and expands the beam to an expanded beam (21) of collimated light. The expanded beam (21) is launched into an air gap (22) for receipt by a holographic optical element (16) disposed on the second ferrule (11). The holographic optical element (16) on the second ferrule (11) receives the expanded beam (21) and focuses it to be received by the fiber held in the second ferrule (11).

Abstract: A beam homogenizer for converting an incident beam of non-uniform spatial power or energy distribution into an output beam of uniform spatial power or energy distribution. The homogenizer is a holographic optical element constructed from an array of facets or subholograms and positioned at a first plane in the path of an incident signal. The transmittance from each subhologram is uniformly spread across a target at a second plane that is spaced away from the first plane Another optical element, such as a holographic collimation element, may be placed at the second plane to collimate the transmittances thereupon.

Abstract: The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.

Abstract: A passively aligned optical interconnect is described for use as a wavelength division multiplexer (WDM) and demultiplexer. The device makes use of silicon waferboard for a low cost interconnect. Computer generated holograms are used to effect the multiplexing/demultiplexing as well as focusing of the beams. In an alternative embodiment, the device is used as a beam splitter for monochromatic light. In yet another embodiment, the device is used to spatially separate the polarization states of light.

Abstract: A passively aligned bi-directional optoelectronic transceiver module assembly utilizes a computer generated hologram as a diffractor to split/combine light beams of two different wavelengths. The entire assembly is constructed of monocrystalline silicon which is photolithographically batch processed to provide a low cost, compact structure with precision tolerances which is inherently passively aligned upon assembly.

Abstract: The disclosure describes an optical interconnect which utilizes a silicon waferboard (1) with grooves (3,4) etched to expose preferred crystallographic planes to effect alignment of focusing elements (5) between optical waveguides (6) and optoelectronic devices (2). The focusing elements (5) are made of silicon wafers and are etched to expose crystal planes which compliment crystal planes of cavities or grooves which are etched in the waferboard. The focusing elements may have holograms (7) formed thereon for efficient focusing to the optical waveguide (6).

Abstract: This invention is directed to an electrically conductive gel comprising an extrinsically conductive gel having dispersed therein a quantity of an intrinsically conductive polymer, where said polymer is present in the amount of between about 0.03 to 1.6%, by weight. Preferred conductive polymers are those selected from the class of polypyrrole, polyaniline, polyanisidine, polythiophene, and derivatives of these base polymers.

Abstract: A connector assembly (10) and a method of manufacture include a connector sheet (30) formed of a fine web of insulating strands (32, 34) woven together to define a mesh of cavities (35) containing discrete contacts (36, 40) held by an adhesive (38) to define an ordered anisotropic area of discrete contact points useful in interconnecting contact pads (24) of a component (20) to contact pads (18) of a circuit (12). A connector housing (60) is provided to clamp the component (20) to the circuit (12) with the connector sheet (30) therebetween.

Abstract: A connector assembly (10) for electrically interconnecting a component (20) to a circuit (12) includes a housing (50) containing the component with conductive pads (22) of the component and conductive pads (14) of the circuit aligned with a connector (30) including a flexible film (34) carrying contact pads (38, 40) interconnected by a conductive material (42) in a hole (36) and carrying conductive gel contacts (44, 46) which project above and below the film surface to be compressed upon housing closure to drive the said component against the said film and circuit to thus minimize contact forces.

Abstract: An electrical connector (30) includes a body (34) of elastomeric material having cavities (38) containing a conductive gel (42) operable upon deformation of the body of said connector to interconnect conductive pads (14, 22) between components such as a printed circuit board (12) and a chip carrier (18). An alternative embodiment uses a connector body (34') comprised of a sheet (48) of a low thermal coefficient of expansion material with separate inserts (50) of a higher thermal coefficient of expansion fitted in sheet perforations (49).

Abstract: An electrical connector (30) for interconnecting the contacts (22) of a component (18) to the contacts (14) of a circuit (12) includes a planar laminate of insulating sheets (38, 42) and a layer of insulating gel (46) having holes (40, 44) extending through the sheets and the gel (46) with a conductive gel (48) in said holes of a volume to be compressed to flow axially to interconnect the component and circuit contacts.