Patents by Inventor John R. Saxelby, Jr.
John R. Saxelby, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6710257Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.Type: GrantFiled: March 15, 2002Date of Patent: March 23, 2004Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Walter R. Hedlund, III
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Patent number: 6549409Abstract: A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative semiconductor component mounted on said side, an encapsulating material filling the gap, and relatively taller, lower heat density, components mounted on the other side of the circuit board, the gap being characterized by an average thermal-resistance of less than 1° C.−in2/Watt.Type: GrantFiled: August 21, 2000Date of Patent: April 15, 2003Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Michael D. Evans, Patrizio Vinciarelli
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Patent number: 6483706Abstract: Heat is conducted, from a heat generating electronic device that is mounted in a gap between a circuit board and a heat dissipator, along a path that includes a path segment that passes along conductive runs on the circuit board and another segment that spans the gap at a location adjacent to the device, the other path segment being spanned predominantly by a non-metallic piece that has a thermal conductivity of at least 7 W/m-°K.Type: GrantFiled: December 22, 2000Date of Patent: November 19, 2002Assignee: VLT CorporationInventors: Patrizio Vinciarelli, John R. Saxelby, Jr.
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Patent number: 6403009Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.Type: GrantFiled: June 22, 1999Date of Patent: June 11, 2002Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Walter R. Hedlund, III
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Patent number: 5945130Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.Type: GrantFiled: February 20, 1997Date of Patent: August 31, 1999Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Walter R. Hedlund, III
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Patent number: 5938104Abstract: A method for use with a direct metal bonding type process in which a metal layer is bonded to an insulating layer. The metal layer is applied to the insulating layer to enable a direct metal bond to be formed between the layers. The integrity of the bond between a portion of the layers is reduced by providing, prior to bonding, an interrupter between the portion of the layers. A structure in which a metal layer is directly metal bonded to an insulating layer and includes an interrupter between a portion of the metal layer and a portion of the insulating layer. The interrupter reduces the integrity of the bond between the portion of the metal layer and the portion of the insulating layer. The structure includes other features similar to those set forth with respect to the above described method.Type: GrantFiled: October 14, 1998Date of Patent: August 17, 1999Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Brant T. Johnson
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Patent number: 5876859Abstract: A method for use with a direct metal bonding type process in which a metal layer is bonded to an insulating layer. The metal layer is applied to the insulating layer to enable a direct metal bond to be formed between the layers. The integrity of the bond between a portion of the layers is reduced by providing, prior to bonding, an interrupter between the portion of the layers. A structure in which a metal layer is directly metal bonded to an insulating layer and includes an interrupter between a portion of the metal layer and a portion of the insulating layer. The interrupter reduces the integrity of the bond between the portion of the metal layer and the portion of the insulating layer. The structure includes other features similar to those set forth with respect to the above described method.Type: GrantFiled: December 15, 1995Date of Patent: March 2, 1999Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Brant T. Johnson
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Patent number: 5728600Abstract: A method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the one face of the substrate that bears conductive pads is left unencapsulated.An encapsulated circuit including a substrate having two faces and perimeter sides around the faces and a circuit formed on the substrate. The substrate also includes conductive pads that are formed on a portion of one of the faces near one of the sides and are connected to the circuit. An integrally formed encapsulating mass encapsulates all of the one face except in the region of the pads, all of the other face except in a region opposite to the region of the pads, and all of the sides.Type: GrantFiled: November 15, 1994Date of Patent: March 17, 1998Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Walter R. Hedlund, III
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Patent number: 4866505Abstract: Non-uniform compressional, thermal dissipation and thermal expansion stresses in packaged chip devices are eliminated or substantially reduced by providing an aluminum attachment layer on the back side of wafers from which the chips themselves, to be mounted in the packaged chip devices, are produced. The aluminum-backed chips produced from such aluminum-backed wafers can be attached to cavities or tabs of packages such that essentially 100% attachment or bonding contact of the chip back side to the package is obtained when the chip is attached thereto with a gold eutectic preform material.Type: GrantFiled: July 18, 1988Date of Patent: September 12, 1989Assignee: Analog Devices, Inc.Inventors: Carl M. Roberts, John R. Saxelby, Jr., Roger M. Moseson
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Patent number: 4388512Abstract: A method and apparatus for forming a spherical shape on the end of an aluminum wire using a relatively low voltage across an arc gap to heat the end. Because the voltage is below the minimum sparking potential, a high voltage impulse is superimposed on the electrode to ionize the gas therebetween and initiate the arc. The gap may be in a protective environment such as an inert gas to prevent the formation of additional oxide. The wire may then be used in an aluminum ball bond.Type: GrantFiled: March 9, 1981Date of Patent: June 14, 1983Assignee: Raytheon CompanyInventors: Thomas E. Salzer, John R. Saxelby, Jr.