Patents by Inventor John R. Siomkos

John R. Siomkos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Atomic layer deposition encapsulation for power amplifiers in RF circuits
    Patent number: 8492908
    Abstract: Power amplifiers and methods of coating a protective film of alumina (Al2O3) on the power amplifiers are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the power amplifier in a precisely controlled manner. Thus, the ALD process can form a uniform film that is substantially free of free of pin-holes and voids.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: July 23, 2013
    Assignee: RF Micro Devices, Inc.
    Inventors: John R. Siomkos, Merrill Albert Hatcher, Jr., Jayanti Jaganatha Rao
  • Leadless surface mountable assembly
    Patent number: 5379185
    Abstract: A leadless surface mountable assembly (100) includes a heat dissipating cover (110), a substrate (120), a heat generating semiconductor device (130), and a spacer (140). The substrate (120) is mounted on the interior surface (115) of the cover (110). The heat generating semiconductor device (130) is thermally coupled to the cover (110) and electrically coupled to the substrate (120). The spacer (140) has an interface portion (147) which provides an electrical interface to the substrate (120). Electrical contacts (144) are disposed on the interface portion (147) of the spacer (140) and are electrically coupled to the substrate (120) through electrical conductors (145) within the spacer (140).
    Type: Grant
    Filed: November 1, 1993
    Date of Patent: January 3, 1995
    Assignee: Motorola, Inc.
    Inventors: Curtis Griffin, John R. Siomkos, Geroncio Tan
  • Microstripe filter having edge flared structures
    Patent number: 5160906
    Abstract: A transmission line structure comprises a dielectric substrate (11) having first and second opposing sides separated by a first distance (3). A transmission line (13) is disposed on the first side while an opposed conductor (12) is disposed on the second side. The transmission line (13) has a first edge (4) a second edge (6), and a midde portion (8). Thicknesswise, the middle portion (8) is separated from the opposed conductor by the first distance (3), and at least a portion of the first edge (4) is separated from the opposed conductor by a second distance less than the first distance (3).
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: November 3, 1992
    Assignee: Motorola, Inc.
    Inventors: John R. Siomkos, Philip M. Huang