Abstract: A thermal water purification system and a related method including distilling units consecutively flowed through by raw feed liquid, each having a boiling liquid section and a vapor section, and including a heat exchanger cavity adapted to transfer thermal energy to the raw feed liquid before entering the boiling liquid section of a first distilling unit. Heat exchanger tubes in fluidic communication with the heat exchanger cavity extend through the boiling liquid section of the first distilling unit to transfer thermal energy from a medium in the tubes to cause the raw feed liquid to boil. Preheating tubes extend through the vapor section of each distilling unit to heat the raw feed liquid before entering the boiling sections using thermal energy from vapor condensing against external surfaces of the preheating tubes, which produces the distillate liquid that flows through a discharge port and a conduit supplying a storage tank.

Abstract: The present invention relates to a thermal water purification system for producing a distillate liquid from a raw liquid, including: a plurality of distilling units which are consecutively flowed through by the raw feed liquid, wherein each distilling unit includes one boiling liquid section and one vapor section adjacent thereto, and wherein any two consecutive distilling units, respectively an upstream distilling unit and a downstream distilling unit, are implemented such that the boiling liquid section of the downstream distilling unit is separated from the vapor section of the upstream distilling unit by a liquid-tight and vapor-tight separation plate, and separated from the vapor section of the downstream distilling unit by a liquid-tight and vapor-permeable membrane; a plurality of heat exchanger tubes adapted to boil the raw feed liquid inside the boiling liquid sections; and a plurality of preheating tubes adapted to preheat the raw feed liquid before it flows inside the boiling liquid sections.

Abstract: A heat transfer assembly for transferring heat from a heat generating device to a circulating fluid, said heat transfer assembly comprising an evaporator device having at least one microchannel formed therein, in thermally conductive contact with said heat generating device, a condenser device, actuating means and manifold means for circulating said fluid between said evaporator device and said condenser device, wherein said heat transfer assembly further comprises a bubble generator capable to create bubbles in said at least one microchannel at a controlled frequency.

Abstract: An integrated circuit package includes a stacked integrated circuit chip arrangement (140) placed on a circuit substrate. The stacked IC chip arrangement includes a first IC chip (110) and a second IC chip (120), each having an array of terminals (116, 126) and being positioned in a face-to-face manner. An interposed substrate (130) is positioned between the first IC chip (110) and the second IC chip (120) such that circuitry disposed on the interposed substrate (130) provides electrical connection among the arrays of terminals of the first IC chip (110) and the second IC chip (120) and external circuitry.

Abstract: The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.

Abstract: A bonding verification process which incorporates bonding test patterns and verifies the integrity of bonds by inspecting the bonding test patterns. For a bonding agent of solder, the bonding verification process verifies the integrity of solder connections by inspecting the bonding test patterns. The bonding test patterns can be implemented in a variety of configurations which verify several properties of the soldering process.

Abstract: A test board is provided with a plurality of cavities that are covered by a film and arranged in a know pattern to coincide with the components to be inserted. The component lead is inserted through the film and into the cavities on the test board. The component lead is removed from the test board. The location of the resulting hole in the film is measured and compared to its intended target to determine the accuracy of the insertion equipment.