Abstract: An optical system and method for controlling light propagation along a light path. An optical element such as a lens is formed of a first light transmitting material and has a surface finish effective to scatter light impinging on the surface. Index matching material contacts to a portion of the surface so as to reduce or nullify the scattering effects of the surface finish within the portion. This allows the first optical element to have surfaces that have been generally prepared for scattering light and then later selectively negate the scattering effects of the surface finish by contacting portions of the surface with index matching material. As such, light in the optical element directed toward a surface or boundary within selected portion propagates into or out of the optical element. Light outside of the selected portion is scattered. Such an arrangement helps to reduce image degradation due to light outside of the light path being reflected about within the optical system.

Abstract: An optical system and method for controlling light propagation along a light path. An optical element such as a lens is formed of a first light transmitting material and has a surface finish effective to scatter light impinging on the surface. Index matching material contacts to a portion of the surface so as to reduce or nullify the scattering effects of the surface finish within the portion. This allows the first optical element to have surfaces that have been generally prepared for scattering light and then later selectively negate the scattering effects of the surface finish by contacting portions of the surface with index matching material. As such, light in the optical element directed toward a surface or boundary within selected portion propagates into or out of the optical element. Light outside of the selected portion is scattered. Such an arrangement helps to reduce image degradation due to light outside of the light path being reflected about within the optical system.

Abstract: In an actively illuminated imaging system, illumination of a segmented scene is synchronized with an image sensing period. A scene is segmented into a plurality of scene portions utilizing a segmented lens. In an aspect, a first scene portion is illuminated when an imager is actively collecting photogenerated charge from the first scene portion, and a second scene portion is illuminated when an imager is actively collecting photogenerated charge from the second scene portion. The sensitivity of an image sensor is maximized, while simultaneously minimizing the amount of light that must be supplied to illuminate a scene. An irradiance pattern is varied allowing a more uniform distribution of light. Bands of varying wavelength, polarization, and light intensity may be variously applied to illuminate individual scene segments, as needed to enhance an identification of an object in the scene. The present invention is particularly useful with high frame rate imaging systems.

Abstract: In an actively illuminated imaging system, illumination of a segmented scene is synchronized with an image sensing period. A scene is segmented into a plurality of scene portions utilizing a segmented lens. In an aspect, a first scene portion is illuminated when an imager is actively collecting photogenerated charge from the first scene portion, and a second scene portion is illuminated when an imager is actively collecting photogenerated charge from the second scene portion. The sensitivity of an image sensor is maximized, while simultaneously minimizing the amount of light that must be supplied to illuminate a scene. An irradiance pattern is varied allowing a more uniform distribution of light. Bands of varying wavelength, polarization, and light intensity may be variously applied to illuminate individual scene segments, as needed to enhance an identification of an object in the scene. The present invention is particularly useful with high frame rate imaging systems.

Abstract: Exemplary embodiments of the present invention are directed to a photonic sensor and method of operation, in one embodiment a photonic has: a sensing element; a dielectric layer; a first electrode disposed between the sensing element and the dielectric layer; a second electrode positioned in a facing spaced relationship with respect to the dielectric layer, the second electrode being disposed upon a substrate; and wherein an applied voltage between the first and second electrodes attracts the first electrode towards the second electrode resulting in a movement of the sensor and the first electrode and dielectric layer with respect to the second electrode, wherein a path of thermal conductance is provided between the substrate and the sensing element through the first electrode, the dielectric layer and the second electrode, and the dielectric layer and the first electrode return to the facing spaced relationship when the applied voltage is removed.

Abstract: A transparent overlay input device includes a transparent non-conductive substrate, a plurality of transparent conductive electrode pairs and a transparent non-conductive cover. The plurality of transparent conductive electrode pairs are formed on the substrate and each form a proximity sensitive region and include a first electrode that receives an input signal and a second electrode that provides an output signal. The first and second electrodes are capacitively coupled and the capacitance of the electrode pair changes when a conductive member, e.g., a user's finger, is located near the electrode pair. The transparent non-conductive cover is formed on the substrate over the electrode pairs.

Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.

Abstract: An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.

Abstract: An integrated switch-indicator unit includes a light emitting diode (LED) structure for providing a plurality of indicators and an overlay input device integrated with the LED structure. The overlay input device includes a non-conductive substrate and a plurality of conductive electrode pairs. The plurality of conductive electrode pairs are formed on the substrate and each form a proximity sensitive region and include a first electrode that receives an input signal and a second electrode that provides an output signal. The first and second electrodes are capacitively coupled and the capacitance of the electrode pair changes when a conductive member, e.g., a user's finger, is located near the electrode pair.

Abstract: A refractive block includes a light-entrance surface configured to be mounted in contact with a refractive boundary of a vehicle, and a light-exit surface wherein the refractive block is configured to refract an optical path of light corresponding to an imaged area and to direct the light to an image-sensing component.

Abstract: A self testing CMOS imager chip includes a controller which outputs a sewer signal, a dump signal, a collect signal, and a read signal, and a pixel array connected to the controller including a plurality of pixels arranged in an array of rows and columns, each pixel having a collect gate disposed adjacent a collect well for receiving a charge in response to application of the collect signal to the collect gate, a sewer for injecting a charge into the collect well in response to the concurrent application of the sewer signal to the sewer and the collect signal to the collect well, a read gate disposed adjacent a read well for receiving the injected charge from the collect well in response to application of the read signal to the read gate and the absence of the collect signal at the collect gate, and a transistor having a gate coupled to the read well, a source for receiving the read signal, and a drain coupled to an output node connected to the controller.

Abstract: An integrated switch-indicator unit includes a light emitting diode (LED) structure for providing a plurality of indicators and an overlay input device integrated with the LED structure. The overlay input device includes a non-conductive substrate and a plurality of conductive electrode pairs. The plurality of conductive electrode pairs are formed on the substrate and each form a proximity sensitive region and include a first electrode that receives an input signal and a second electrode that provides an output signal. The first and second electrodes are capacitively coupled and the capacitance of the electrode pair changes when a conductive member, e.g., a user's finger, is located near the electrode pair.

Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.

Abstract: A transparent overlay input device includes a transparent non-conductive substrate, a plurality of transparent conductive electrode pairs and a transparent non-conductive cover. The plurality of transparent conductive electrode pairs are formed on the substrate and each form a proximity sensitive region and include a first electrode that receives an input signal and a second electrode that provides an output signal. The first and second electrodes are capacitively coupled and the capacitance of the electrode pair changes when a conductive member, e.g., a user's finger, is located near the electrode pair. The transparent non-conductive cover is formed on the substrate over the electrode pairs.

Abstract: An active matrix transistor array substrate for a reconfigurable vacuum fluorescent display comprising a set of individually addressable pixels and an isolation grid surrounding each pixel of the set and isolating each pixel of the set from all other pixels of the set. The isolation grid is especially advantageous in a high density active matrix display for preventing one pixel that is switched off from inhibiting a neighboring pixel that is switched on from fully illuminating.

Abstract: A pixel switch circuit for performing a select-and-hold function for a pixel within a reconfigurable active matrix vacuum fluorescent display is provided. The pixel switch circuit employs a driver transistor whose geometry can be tailored to optimally match the on-current for the particular phosphor of each pixel. The pixel switch circuit is particularly suitable for vacuum fluorescent displays employing different colored phosphors which have differing luminous efficiencies corresponding to the different colors.

Abstract: A matrix addressable vacuum fluorescent display has redundant circuitry comprising a row electrode and two sets of column electrodes for each row and column of pixels, respectively, and two sets of FETs separately coupled to row and column electrodes to turn on the phosphor element for a given pixel, each set of FETs supplying part of the phosphor energizing current. If one column electrode or one set of transistors is defective the remaining set is effective to illuminate the phosphor at least to some suitable intensity.

Abstract: A thin film field effect transistor has an island of polysilicon on the surface of a substrate, preferably of an insulating material. A layer of silicon dioxide is on the surface of the substrate and surrounds the polysilicon island. The silicon dioxide layer is of substantially uniform thickness and contacts the edge of the polysilicon island. A gate insulator layer, preferably of silicon dioxide, of substantially uniform thickness is on the surface of the polysilicon island. A conductive gate, preferably of doped polysilicon, is on the gate insulator layer and extends across a portion of the polysilicon island. The portions of the polysilicon island at opposite sides of the gate are doped to form the source and drain of the transistor. The transistor is formed by applying a layer of polysilicon on the surface of a substrate and applying a mask over the portion of the polysilicon layer which is to form the island.

Abstract: A method of fabricating polycrystalline silicon thin film field effect transistors on low cost alkaline earth alumino-silicate glass substrates which can tolerate device processing temperatures of approximately 800.degree. C.

Abstract: A method of treating thin films containing a significant atomic proportion of hydrogen to enable such films to be subjected to elevated temperatures without blistering. The films are subjected to a significant, i.e. damaging, high implantation prior to heat treatment.