Abstract: An electrolyte dispensing ampule for deferred action batteries comprises a spring having means at both ends thereof for forming a closed, generally cylindrical space inside the spring and a metal layer covering the spring to hermetically seal the space. An electrolyte solution is contained in the spring and is dispersed to activate the battery when set-back forces extend the spring and break the sealing layer.

Abstract: A cooling system is described which is appropriate to many high performance missiles. The invention comprises heat pipe/thermal diode devices, and a heat storage medium. Heat generated by electronic components of a missile is either conducted to the skin of the missile to be dissipated or is stored internally for later dissipation.

Abstract: A converging/diverging venturi assembly positioned in a subsonic fluid flow stream for producing a supersonic flow velocity in the downstream diverging section with a pressure pickoff system that is located adjacent a minimum static pressure location just prior to a point where shock waves begin to form. The low pressure in the supersonic region in front of the shock wave may be utilized for reducing the boiling temperature of a fluid in a boiler by porting a tube from the low pressure venturi to the boiler, thus improving the heat transfer characteristics of the boiler where the boiler is used for a heat sink for heat sources in a mobile vehicle.

Abstract: A semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to the bumps of the die, coating the bumps and active area with unfired glass and firing the glass at a temperature generally below 450.degree. C. The method also includes bonding the film strip leads to the bumps and firing the glass simultaneously or firing the glass and remelting glass covering the bumps to bond the leads to the bumps through the fired glass.

Abstract: a semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to the bumps of the die, coating the bumps and active area with unfired glass and firing the glass at a temperature generally below 450.degree. C. The method also includes bonding the film strip leads to the bumps and firing the glass simultaneously or firing the glass and remelting glass covering the bumps to bond the leads to the bumps through the fired glass.