Patents by Inventor John Rausch

John Rausch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming orifice plate for fluid ejection device
    Patent number: 7807079
    Abstract: A method of forming an orifice plate for a fluid ejection device includes depositing and patterning a mask material on a conductive surface, forming a first layer on the conductive surface, forming a second layer on the first layer, and removing the first layer and the second layer from the conductive surface, wherein the first layer includes a metallic material and the second layer includes a polymer material.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: October 5, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John Rausch, Kevin Brown, Rio Rivas
  • High resolution inkjet printer
    Publication number: 20060187266
    Abstract: A high-resolution printer includes a printhead having optimized features including 3 to 20 micron diameter orifices spaced apart from adjacent orifices by a distance of between about 15 and 75 microns. The orifice plate is electroformed and plated to a thickness ranging from about 6 to 19 microns. A barrier layer secures the orifice plate to a printhead substrate.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 24, 2006
    Inventors: Rio Rivos, Lawrence White, Ed Friesen, John Rausch
  • Orifice plate and method of forming orifice plate for fluid ejection device
    Publication number: 20050110188
    Abstract: A method of forming an orifice plate for a fluid ejection device includes depositing and patterning a mask material on a conductive surface, forming a first layer on the conductive surface, forming a second layer on the first layer, and removing the first layer and the second layer from the conductive surface, wherein the first layer includes a metallic material and the second layer includes a polymer material.
    Type: Application
    Filed: January 5, 2005
    Publication date: May 26, 2005
    Inventors: John Rausch, Kevin Brown, Rio Rivas
  • Orifice plate and method of forming orifice plate for fluid ejection device
    Patent number: 6857727
    Abstract: A method of forming an orifice plate for a fluid ejection device includes depositing and patterning a mask material on a conductive surface, forming a first layer on the conductive surface, forming a second layer on the first layer, and removing the first layer and the second layer from the conductive surface, wherein the first layer includes a metallic material and the second layer includes a polymer material.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: February 22, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John Rausch, Kevin Brown, Rio Rivas