Abstract: Systems and methods for electrical component, e.g., brush, manufacture are provided that control grain orientation. The systems and methods utilize hot pressing techniques to enhance the properties and functionalities of the electrical components/brushes. An intermediate work product characterized by a grain orientation is initially formed through a conventional pressing technique. The conventionally-pressed intermediates are positioned within a cavity/die with the grain orientation in a predetermined orientation relative to the hot press force to be applied thereto. The hot pressed final product exhibits superior resistivity, strength and apparent density/durability. Surface features may be formed on the face(s) of the final work product during the hot pressing step that cannot be achieved in conventional processing techniques. Multi-layered assemblies are provided that may be cross-linked or inter-bonded along an interface therebetween. Advantageous articles of manufacture, e.g.

Abstract: Removable cards having deployable antennae.

Abstract: Attachable/detachable antennae for use with electronic systems.

Abstract: A carrying case for a personal computer card may include an integral antenna. The carrying case may be secured onto a laptop computer so that the antenna extends above the laptop computer. The case may include a pair of hingedly connected portions, one of which may extend along the screen of the laptop computer and the other which may extend above the laptop computer while the case is secured to the upper edge of the laptop computer display screen. A cable may extend from the antenna within the case down to a personal computer card plugged into the computer.

Abstract: Methods and apparatus are provided for applying solder in precise amounts to fine pitch leads such as those suitable for direct chip attachment (DCA) or flip-chip applications by using a heated platen to apply pressure to solder overlaying a plurality of lands on circuitized substrate. In one embodiment paste solder screened through a mask having apertures each corresponding to a plurality of land locations. In another embodiment, a web of solder foil is accurately positioned over a plurality of fine pitch lands. In each embodiment, a heated platen includes at least one active element corresponding in size and shape to the area having a plurality of fine pitch lands. A third embodiment includes individual platens for lands to which solder is to be applied.