Abstract: Techniques for debinding additively fabricated parts are described that do not require solvent debinding or catalytic debinding, and that may be performed using only thermal debinding in a furnace. As a result, in at least some cases debinding and sintering may take place sequentially within a single furnace. In some embodiments, the techniques may utilize particular materials as binders that allow for a thermal debinding process that does not negatively affect the parts.

Abstract: Methods of additive manufacturing using noble metals and/or copper metal, and binder compositions for use during the additive manufacturing methods, are generally described. In some instances, the methods of additive manufacturing include de-binding (and in some cases sintering steps) that afford metal-based composites, de-bound metal structures, and metal objects containing noble metals (e.g., silver, gold, platinum) and/or copper that have improved properties, such as relatively high densities. In certain aspects, combinations of certain metal powders (e.g., noble metal and/or copper powders) with certain binder compositions may result in improved properties of resulting metal objects produced by the additive manufacturing process, such as relatively low surface roughnesses. The binder compositions described may include a low molecular weight polymer (e.g., including an acrylic acid repeat unit) and, in some cases, a cross-linking agent.

Abstract: Techniques for debinding additively fabricated parts are described that do not require solvent debinding or catalytic debinding, and that may be performed using only thermal debinding in a furnace. As a result, in at least some cases debinding and sintering may take place sequentially within a single furnace. In some embodiments, the techniques may utilize particular materials as binders that allow for a thermal debinding process that does not negatively affect the parts.

Abstract: An exemplary method and system of addressing an integrated circuit within a daisy chain network. In the exemplary method, the address of the integrated circuit may be initialized to a predetermined initial address. The integrated circuit may receive a command that includes a type identifier and an address field. Based on the type identifier, the type of command may be determined. As a result of the determination, reading the address from the address field. The read address may be stored in a register. The address may be modified, and may be output. Upon receipt of the data or a command, the integrity of the data including data within the received command, may be confirmed by an error checking algorithm.

Abstract: An exemplary method and system of addressing an integrated circuit within a daisy chain network. In the exemplary method, the address of the integrated circuit may be initialized to a predetermined initial address. The integrated circuit may receive a command that includes a type identifier and an address field. Based on the type identifier, the type of command may be determined. As a result of the determination, reading the address from the address field. The read address may be stored in a register. The address may be modified, and may be output. Upon receipt of the data or a command, the integrity of the data including data within the received command, may be confirmed by an error checking algorithm.

Abstract: A stent for occluding the human ductus arteriosus comprises a length of wire of shape memory effect or superelastic material which is expandable from a relatively straightened state for introduction into the patient to an occluding state wherein the wire defines an occluding anchor part and a spiral anchor part and a straight linking part connecting the two wherein the wire has a series of turns extending over the cross-sectional area of the occluding anchor part.

Abstract: A stent for occluding the human ductus arteriosus comprises a length of wire of shape memory effect or superelastic material which is expandable from a relatively straightened state for introduction into the patient to an occluding state wherein the wire defines an occluding anchor part and a spiral anchor part and a straight linking part connecting the two wherein the wire has a series of turns extending over the cross-sectional area of the occluding anchor part.

Abstract: A stent for occluding the human ductus arteriosus comprises a length of wire of shape memory effect or superelastic material which is expandable from a relatively straightened state for introduction into the patient to an occluding state wherein the wire defines an occluding anchor part and a spiral anchor part and a straight linking part connecting the two wherein the wire has a series of turns extending over the cross-sectional area of the occluding anchor part.

Abstract: An IC chip having an analog-to-digital converter together with control circuitry for effecting switchover between normal-power mode and low-power mode. The control circuitry includes a first D-type flip-flop with reset which receives on its "D" input a continuous high signal; on its differential clock inputs the flip-flop receives complementary logic signals derived from the "conversion start" (CONVST) signal applied to one pin of an 8-pin chip. In normal mode, the CONVST signal is a short pulse having an initial negative-going (falling) leading edge, and the flip-flop responds to that leading edge by producing a high Q output (CONVEN). This signals the A/D converter to carry out a conversion. In low-power mode, the CONVST short pulse is positive. The subsequent negative-going (falling) trailing edge of the pulse activates the flip-flop to cause its Q output to go high and turn on the A/D converter.