Patents by Inventor John Richard Dangler
John Richard Dangler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8961280Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.Type: GrantFiled: August 27, 2012Date of Patent: February 24, 2015Assignee: International Business Machines CorporationInventors: John Richard Dangler, Phillip Duane Isaacs, Arvind Kumar Sinha
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Publication number: 20150007427Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.Type: ApplicationFiled: August 27, 2012Publication date: January 8, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Richard Dangler, Phillip Duane Isaacs, Arvind Kumar Sinha
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Patent number: 8863046Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer electronic structure and a method of manufacture is presented.Type: GrantFiled: April 11, 2008Date of Patent: October 14, 2014Assignee: International Business Machines CorporationInventors: John Richard Dangler, Matthew Stephen Doyle
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Patent number: 8549444Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into multilayer cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer structure and a method of manufacture are presented.Type: GrantFiled: April 11, 2008Date of Patent: October 1, 2013Assignee: International Business Machines CorporationInventors: John Richard Dangler, Matthew Stephen Doyle
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Patent number: 8287336Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.Type: GrantFiled: March 14, 2007Date of Patent: October 16, 2012Assignee: International Business Machines CorporationInventors: John Richard Dangler, Phillip Duane Isaacs, Arvind Kumar Sinha
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Patent number: 8251749Abstract: A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.Type: GrantFiled: November 17, 2010Date of Patent: August 28, 2012Assignee: International Business Machines CorporationInventors: John Richard Dangler, Matthew Stephen Doyle, Thomas Donald Kidd, Joseph Kuczynski, Kevin Albert Splittstoesser, Timothy Jerome Tofil
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Publication number: 20120122342Abstract: A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.Type: ApplicationFiled: November 17, 2010Publication date: May 17, 2012Applicant: International Business Machines CorporationInventors: John Richard Dangler, Matthew Stephen Doyle, Thomas Donald Kidd, Joseph Kuczynski, Kevin Albert Splittstoesser, Timothy Jerome Tofil
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Patent number: 8015701Abstract: A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.Type: GrantFiled: February 22, 2008Date of Patent: September 13, 2011Assignee: International Business Machines CorporationInventors: Paul V. Abrahamson, John Richard Dangler, Daniel Lee Dawiedczyk, Matthew Stephen Doyle
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Patent number: 7921403Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented.Type: GrantFiled: April 11, 2008Date of Patent: April 5, 2011Assignee: International Business Machines CorporationInventors: John Richard Dangler, Matthew Stephen Doyle
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Publication number: 20090258194Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer electronic structure and a method of manufacture is presented.Type: ApplicationFiled: April 11, 2008Publication date: October 15, 2009Inventors: John Richard Dangler, Matthew Stephen Doyle
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Publication number: 20090255713Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented.Type: ApplicationFiled: April 11, 2008Publication date: October 15, 2009Inventors: John Richard Dangler, Matthew Stephen Doyle
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Publication number: 20090255715Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into multilayer cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer structure and a method of manufacture are presented.Type: ApplicationFiled: April 11, 2008Publication date: October 15, 2009Inventors: John Richard Dangler, Matthew Stephen Doyle
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Publication number: 20090211792Abstract: A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.Type: ApplicationFiled: February 22, 2008Publication date: August 27, 2009Inventors: Paul V. Abrahamson, John Richard Dangler, Daniel Lee Dawiedezyk, Matthew Stephen Doyle
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Publication number: 20090189635Abstract: A method and apparatus implement reduced noise coupling effects on single ended clocks, and a design structure on which the subject circuit resides is provided. A clock receiver includes a clock voltage reference that is generated from received clock peaks and valleys of a received input clock signal. The received clock peaks (VT) and the received clock valleys (VB) are continuously sampled. The clock voltage reference is set, for example, equal to an average of VT and VB; or ((VT+VB)/2).Type: ApplicationFiled: January 28, 2008Publication date: July 30, 2009Inventors: Roger Allen Booth, JR., John Richard Dangler, Matthew Stephen Doyle, Jesse Hefner, Thomas W. Liang, Ankur Kanu Patel, Paul W. Rudrud
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Patent number: 7214874Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device includes two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.Type: GrantFiled: November 4, 2004Date of Patent: May 8, 2007Assignee: International Business Machines CorporationInventors: John Richard Dangler, Phillip Duane Isaacs, Arvind Kumar Sinha
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Patent number: 7086869Abstract: In a flat flex cable, signal lines are surrounded by logic ground planes above and below which are viaed together left and right. The ground planes coupled with the flex cable dielectric determine characteristic the impedance and attenuation of the cable and provide differential signal EMI shielding. All signal layers and logic ground planes are enclosed within the two outermost shield layers which are viaed together left and right and around the connectors to enclose both signal layers and logic ground planes to provide common mode EMI shielding.Type: GrantFiled: January 20, 2005Date of Patent: August 8, 2006Assignee: International Business Machines CorporationInventors: John Richard Dangler, Matthew Stephen Doyle, Thomas Donald Kidd, Bradley Lewis Martin, Kevin J. Przybylski, Jason Thomas Stoll
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Patent number: 6024580Abstract: A flex cable pad on pad terminal structure is shown having raised connector pads formed using a rigid stiffener with raised features or bumps formed integral with the stiffener; aligned with the connector pad surfaces; and laminated to the flex cable surface opposite the surface presenting the exposed connector pad surfaces, to create raised contact pads that are not subject to relaxation over time when subjected to high contact normal forces. The use of a metal stiffener which has been coined to produce the raised features aligned with the contact pad locations and lamination using a film or layer of thermocuring adhesive affords an economical process and assembly technique that also effects hot deformation of the flex cable at the contact pad locations.Type: GrantFiled: January 8, 1998Date of Patent: February 15, 2000Assignee: International Business Machines CorporationInventors: John Richard Dangler, Mark Kenneth Hoffmeyer, Thomas Donald Kidd, Miles Frank Swain