Patents by Inventor John Richard Mertz

John Richard Mertz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6180317
    Abstract: An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.
    Type: Grant
    Filed: November 18, 1991
    Date of Patent: January 30, 2001
    Assignee: International Business Machines Corporation
    Inventors: Robert David Allen, Richard Allen Day, Donald Herman Glatzel, William Dinan Hinsberg, John Richard Mertz, David John Russell, Gregory Michael Wallraff
  • Patent number: 5747223
    Abstract: An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.
    Type: Grant
    Filed: July 9, 1996
    Date of Patent: May 5, 1998
    Assignee: International Business Machines Corporation
    Inventors: Robert D. Allen, Richard Allen Day, Donald Herman Glatzel, William Dinan Hinsberg, John Richard Mertz, David John Russell, Gregory Michael Wallraff