Patents by Inventor John Richard Wilson

John Richard Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Subtractive design for heat sink improvement
    Patent number: 11003808
    Abstract: Aspects of the disclosed technology relate to techniques of improving heat sink designs based on systematic mass removal. A thermal simulation is performed to determine thermal property values for a heat sink design. The thermal property value of a portion of the heat sink design relates to the portion's contribution to thermal performance of the heat sink design. One or more portions of the heat sink design are selected based on the thermal property values and removed to generate a new heat sink design. The performing operation and the removing operation are repeated until one of one or more predetermined conditions is met.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: May 11, 2021
    Assignee: Siemens Industry Software Inc.
    Inventors: Robin Bornoff, John Richard Wilson, John Parry
  • Thermal model obfuscation
    Patent number: 10783303
    Abstract: Various aspects of a technology disclosed herein relate to thermal model obfuscation. A thermal model for a first assembly is received. An obfuscated thermal model is then generated from the thermal model. The generation comprises replacing name or names associated with one or more objects in the first assembly with obfuscated names. The obfuscated thermal model can be used in a thermal simulation of a second assembly, of which the first assembly is a component.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: September 22, 2020
    Assignee: Mentor Graphics Corporation
    Inventors: John Parry, Robin Bornoff, John Richard Wilson
  • Thermal Model Obfuscation
    Publication number: 20180349523
    Abstract: Various aspects of the disclosed technology relate to thermal model obfuscation. A thermal model for a first assembly is received. An obfuscated thermal model is then generated from the thermal model. The generation comprises replacing names associated with one or more objects in the assembly with obfuscated names. The obfuscated thermal model can be used in thermal simulation of a second assembly, of which the first assembly is a component.
    Type: Application
    Filed: June 6, 2018
    Publication date: December 6, 2018
    Inventors: John Parry, Robin Bornoff, John Richard Wilson
  • Subtractive Design for Heat Sink Improvement
    Publication number: 20170091356
    Abstract: Aspects of the disclosed technology relate to techniques of improving heat sink designs based on systematic mass removal. A thermal simulation is performed to determine thermal property values for a heat sink design. The thermal property value of a portion of the heat sink design relates to the portion's contribution to thermal performance of the heat sink design. One or more portions of the heat sink design are selected based on the thermal property values and removed to generate a new heat sink design. The performing operation and the removing operation are repeated until one of one or more predetermined conditions is met.
    Type: Application
    Filed: September 27, 2016
    Publication date: March 30, 2017
    Inventors: Robin Bornoff, John Richard Wilson, John Parry