Patents by Inventor John Robert Campbell

John Robert Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200006471
    Abstract: An integrated circuit (IC) including a semiconductor surface layer of a substrate including functional circuitry having circuit elements formed in the semiconductor surface layer configured together with a Metal-Insulator-Metal capacitor (MIM) capacitor on the semiconductor surface layer for realizing at least one circuit function. The MIM capacitor includes a multilevel bottom capacitor plate having an upper top surface, a lower top surface, and sidewall surfaces that connect the upper and lower top surfaces (e.g., a bottom plate layer on a three-dimensional (3D) layer or the bottom capacitor plate being a 3D bottom capacitor plate). At least one capacitor dielectric layer is on the bottom capacitor plate. A top capacitor plate is on the capacitor dielectric layer, and there are contacts through a pre-metal dielectric layer to contact the top capacitor plate and the bottom capacitor plate.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 2, 2020
    Inventors: POORNIKA FERNANDES, SAGNIK DEY, LUIGI COLOMBO, HAOWEN BU, SCOTT ROBERT SUMMERFELT, MARK ROBERT VISOKAY, JOHN PAUL CAMPBELL
  • Patent number: 8163847
    Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: April 24, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Kenneth Paul Zarnoch, John Robert Campbell, Amy Rene Freshour, Hua Guo, John Austin Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager
  • Patent number: 8048819
    Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: November 1, 2011
    Assignee: Momentive Performance Materials Inc.
    Inventors: Slawomir Rubinsztajn, John Robert Campbell, Ryan Christopher Mills, Sandeep Shrikant Tonapi, Ananth Prabhakumar
  • Publication number: 20100087591
    Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
    Type: Application
    Filed: December 10, 2009
    Publication date: April 8, 2010
    Inventors: Kenneth Paul Zarnoch, John Robert Campbell, Amy Rene Freshour, Hua Guo, John Austin Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager
  • Patent number: 7655734
    Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: February 2, 2010
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Kenneth Paul Zarnoch, John Robert Campbell, Amy Rene Freshour, Hua Guo, John Austin Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager
  • Publication number: 20090017195
    Abstract: An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition.
    Type: Application
    Filed: October 23, 2007
    Publication date: January 15, 2009
    Inventors: Michael Alan Vallance, John Robert Campbell, Kenneth Paul Zarnoch, Prameela Susarla, Bryan Patrick Duffey, Gary William Yeager, Michael Joseph O'Brien
  • Publication number: 20080121845
    Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes 4 or more pendant oxetane functional groups. The underfill composition includes greater than about 20 weight percent of the polymeric precursor. Associated article and method are also provided.
    Type: Application
    Filed: August 11, 2006
    Publication date: May 29, 2008
    Applicant: General Electric Company
    Inventors: Ryan Christopher Mills, Slawomir Rubinsztajn, John Robert Campbell
  • Publication number: 20080039608
    Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes an inorganic backbone and one or more pendant oxetane functional groups. Associated article and method are also provided.
    Type: Application
    Filed: August 11, 2006
    Publication date: February 14, 2008
    Applicant: General Electric Company
    Inventors: Ryan Christopher Mills, Slawomir Rubinsztajn, John Robert Campbell
  • Patent number: 7297370
    Abstract: An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: November 20, 2007
    Assignee: General Electric Company
    Inventors: Michael Alan Vallance, John Robert Campbell, Kenneth Paul Zarnoch, Prameela Susarla, Bryan Patrick Duffey, Gary William Yeager, Michael Joseph O'Brien
  • Patent number: 7279223
    Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: October 9, 2007
    Assignee: General Electric Company
    Inventors: Slawomir Rubinsztajn, John Robert Campbell, Ananth Prabhakumar, Sandeep Tonapi
  • Patent number: 7148296
    Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: December 12, 2006
    Assignee: General Electric Company
    Inventors: Kenneth Paul Zarnoch, John Robert Campbell, Amy Rene Freshour, Hua Guo, John Austin Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager
  • Patent number: 7119136
    Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 10, 2006
    Assignee: General Electric Company
    Inventors: John Robert Campbell, Bryan Duffey, John Austin Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager, Kenneth Paul Zarnoch
  • Patent number: 7101923
    Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: September 5, 2006
    Assignee: General Electric Company
    Inventors: John Robert Campbell, Bryan Duffey, John Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager, Kenneth Paul Zarnoch
  • Patent number: 7067595
    Abstract: A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: June 27, 2006
    Assignee: General Electric Company
    Inventors: Kenneth Paul Zarnoch, John Robert Campbell, Glen David Merfeld, John Austin Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager
  • Publication number: 20050181214
    Abstract: A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments of cured formulations can have low coefficients of thermal expansion and/or high glass transition temperatures.
    Type: Application
    Filed: December 7, 2004
    Publication date: August 18, 2005
    Inventors: John Robert Campbell, Slawomir Rubinsztajn, Florian Johannes Schattenmann, Sandeep Shrikant Tonapi, Ananth Prabhakumar, Wing-Keung Woo, Joseph Michael Anostario, Donna Marie Sherman
  • Patent number: 6921785
    Abstract: Disclosed are flame retardant resinous compositions comprising (i) at least one aromatic polycarbonate, (ii) at least one a rubber modified graft copolymer, (iii) at least one silyl borate ester, (iv) at least one organophosphorus compound, and (v) at least one fluoropolymer additive. The compositions exhibit improved surface properties in molded parts.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: July 26, 2005
    Assignee: General Electric Company
    Inventors: John Robert Campbell, Thomas Miebach
  • Publication number: 20040138343
    Abstract: A composition is provided in the present invention comprising functionalized colloidal silica. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. Further embodiments of the present invention include dispersions comprising the functionalized colloidal silica and methods for making.
    Type: Application
    Filed: December 19, 2003
    Publication date: July 15, 2004
    Inventors: John Robert Campbell, Slawomir Rubinsztajn, Joseph Michael Anostario
  • Publication number: 20040102529
    Abstract: A composition is provided in the present invention comprising functionalized colloidal silica. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. Further embodiments of the present invention include dispersions comprising the functionalized colloidal silica and methods for making.
    Type: Application
    Filed: November 22, 2002
    Publication date: May 27, 2004
    Inventors: John Robert Campbell, Slawomir Rubinsztajn, Joseph Michael Anostario
  • Publication number: 20040101688
    Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica, cure catalyst, and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation.
    Type: Application
    Filed: November 22, 2002
    Publication date: May 27, 2004
    Inventors: Slawomir Rubinsztajn, John Robert Campbell, Joseph Michael Anostario, Ananth Prabhakumar, Donna Marie Sherman, Sandeep Tonapi
  • Publication number: 20040034132
    Abstract: Disclosed are flame retardant resinous compositions comprising (i) at least one aromatic polycarbonate, (ii) at least one a rubber modified graft copolymer, (iii) at least one silyl borate ester, (iv) at least one organophosphorus compound, and (v) at least one fluoropolymer additive. The compositions exhibit improved surface properties in molded parts.
    Type: Application
    Filed: August 16, 2002
    Publication date: February 19, 2004
    Applicant: General Electric Company
    Inventors: John Robert Campbell, Thomas Miebach