Patents by Inventor John Robert McMillan

John Robert McMillan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-bonded substrate for integrated circuit package and method of making the same
    Patent number: 8569110
    Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: October 29, 2013
    Assignee: QPL Limited
    Inventors: John Robert McMillan, Xiao Yun Chen, Tung Lok Li
  • Pre-bonded substrate for integrated circuit package and method of making the same
    Patent number: 8513786
    Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: August 20, 2013
    Assignee: QPL Limited
    Inventors: John Robert McMillan, Xiao Yun Chen, Tung Lok Li
  • Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof
    Patent number: 8338924
    Abstract: A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: December 25, 2012
    Assignee: QPL Limited
    Inventors: John Robert McMillan, Xiao Yun Chen, Tung Lok Li
  • SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE WITH SELECTIVE EXPOSURE OF BONDING COMPOUND AND METHOD OF MAKING THEREOF
    Publication number: 20120146199
    Abstract: A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.
    Type: Application
    Filed: October 6, 2011
    Publication date: June 14, 2012
    Applicant: QPL LIMITED
    Inventors: John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI
  • PRE-BONDED SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
    Publication number: 20120149154
    Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.
    Type: Application
    Filed: May 20, 2011
    Publication date: June 14, 2012
    Inventors: John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI
  • PRE-BONDED SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
    Publication number: 20120146200
    Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.
    Type: Application
    Filed: May 20, 2011
    Publication date: June 14, 2012
    Inventors: John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI