Patents by Inventor John Rude

John Rude has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7354533
    Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: April 8, 2008
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Manuel Cavazos, Hua Guo, Glen David Merfeld, John Rude, Erich Otto Teutsch, Kenneth Paul Zarnoch
  • Publication number: 20060287439
    Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
    Type: Application
    Filed: August 28, 2006
    Publication date: December 21, 2006
    Inventors: Kenneth Zarnoch, John Campbell, Amy Freshour, Hua Guo, John Rude, Prameela Susarla, Michael Vallance, Gary Yeager
  • Patent number: 7101923
    Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: September 5, 2006
    Assignee: General Electric Company
    Inventors: John Robert Campbell, Bryan Duffey, John Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager, Kenneth Paul Zarnoch
  • Publication number: 20060167142
    Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
    Type: Application
    Filed: September 23, 2004
    Publication date: July 27, 2006
    Inventors: John Campbell, Bryan Duffey, John Rude, Prameela Susarla, Michael Vallance, Gary Yeager, Kenneth Zarnoch
  • Patent number: 6905637
    Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), and alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: June 14, 2005
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Manuel Cavazos, Hua Guo, Glen David Merfeld, John Rude, Erich Otto Teutsch, Kenneth Paul Zarnoch
  • Publication number: 20050109990
    Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 26, 2005
    Inventors: Gary Yeager, Manuel Cavazos, Hua Guo, Glen Merfeld, John Rude, Erich Teutsch, Kenneth Zarnoch
  • Publication number: 20050075463
    Abstract: A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.
    Type: Application
    Filed: October 3, 2003
    Publication date: April 7, 2005
    Inventors: Kenneth Zarnoch, John Campbell, Glen Merfeld, John Rude, Prameela Susarla, Michael Vallance, Gary Yeager
  • Publication number: 20050075427
    Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
    Type: Application
    Filed: September 23, 2004
    Publication date: April 7, 2005
    Inventors: John Campbell, Bryan Duffey, John Rude, Prameela Susarla, Michael Vallance, Gary Yeager, Kenneth Zarnoch
  • Publication number: 20050075426
    Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
    Type: Application
    Filed: October 3, 2003
    Publication date: April 7, 2005
    Inventors: John Campbell, Bryan Duffey, John Rude, Prameela Susarla, Michael Vallance, Gary Yeager, Kenneth Zarnoch
  • Publication number: 20050075462
    Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
    Type: Application
    Filed: October 3, 2003
    Publication date: April 7, 2005
    Inventors: Kenneth Zarnoch, John Campbell, Amy Freshour, Hua Guo, John Rude, Prameela Susarla, Michael Vallance, Gary Yeager
  • Publication number: 20020177027
    Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.
    Type: Application
    Filed: December 3, 2001
    Publication date: November 28, 2002
    Inventors: Gary William Yeager, Manuel Cavazos, Hua Guo, Glen David Merfeld, John Rude, Erich Otto Teutsch, Kenneth Paul Zarnoch