Abstract: In a circuit package having a connector for connecting a pin array circuit module and a printed circuit board, the connector is a molded plastic planar member with a plurality of openings extending through the member. In each opening, the member has two integral and spaced first and second parts having respectively oppositely aligned faces for receiving therebetween one of the pins. At least one of the parts resiliently extends across the opening, and at least one of the faces is a contact surface which mates with a pin of the module. A conductive layer with a predetermined circuit pattern is disposed on the member and includes conductors which extend from the contact surface to terminals disposed on the bottom surface of the member. The terminals are mateable with the input/output pads of the board. The member is disposed between the board and the module to provide the connection between the module and the board with the terminals of the member and the pads of the board being in contacting relationship.