Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.

Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography.

Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.

Abstract: A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.

Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and spring plate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An anti-tilt mechanism for a drawer assembly, the drawer assembly being in a rack, is disclosed. The anti-tilt mechanism comprises two railing portions coupled to the rack and two brackets, each of the two brackets respectively coupled to one of the two railing portions. Each of the. two brackets comprises a first planar portion and a second planar portion, the second planar portion coupled to the top of the first planar portion and extending substantially perpendicular to the first planar portion, the second planar portion capable of preventing the drawer assembly from tilting during a slidable operation thereof. The anti-tilt mechanism in accordance with the present invention prevents the drawer assembly from tilting during the slidable operation of the assembly. This is desirable because if tilting occurs during the slidable operation of the assembly, the assembly could be damaged and/or a system operator could be injured.

Abstract: An earthquake resistant frame structure which is shippable in a fully populated condition has a base member, a plurality of support members extending from the base member, a top portion disposed over the ends of the support members, a extension member disposed over the top portion, side stiffeners positioned perpendicularly between the support members, and a tie down assembly system positioned between the base member and a flooring surface. The extension member has a platform section and at least two legs depending substantially perpendicularly therefrom that slidingly engage the support members. The two legs have slots therethrough configured to receive fasteners that, when secured to support members, secure and maintain the extension member in position. First and second panels protrude laterally from the frame structure to form an extension area, from which a bracket hingedly depends. A variety of pin arrangements are used to prevent the removal of the bracket from the hinge.

Abstract: An earthquake resistant frame structure which is shippable in a fully populated condition has abase member, a plurality of support members extending from the base member, a top portion disposed over the ends of the support members, a extension member disposed over the top portion, side stiffeners positioned perpendicularly between the support members, and a tie down assembly system positioned between the base member and a flooring surface. The extension member has a platform section and at least two legs depending substantially perpendicularly therefrom that slidingly engage the support members. The two legs have slots therethrough configured to receive fasteners that, when secured to support members, secure and maintain the extension member in position. First and second panels protrude laterally from the frame structure to form an extension area, from which a bracket hingedly depends. A variety of pin arrangements are used to prevent the removal of the bracket from the hinge.