Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract: An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract: A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.

Abstract: A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

Abstract: An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.

Abstract: In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.

Abstract: An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

Abstract: An apparatus and method are provided for effectively and efficiently testing or burning-in land grid array (LGA) modules, through the use of a self-aligning clamping device for clamping the LGA against a circuit card. The self-aligning clamping device includes a clamping body having an LGA contact surface adapted for bearing against the LGA module, and a pivot element for receiving a clamping force from a ram element selectively movable along a ram axis oriented generally normal to the array of electrical test contacts on the circuit card and transferring the clamping force to the clamping body. The clamping body is also a heat exchanger for maintaining the LGA module at a desired operating temperature during test or burn-in.

Abstract: A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An earthquake resistant frame structure which is shippable in a fully populated condition has abase member, a plurality of support members extending from the base member, a top portion disposed over the ends of the support members, a extension member disposed over the top portion, side stiffeners positioned perpendicularly between the support members, and a tie down assembly system positioned between the base member and a flooring surface. The extension member has a platform section and at least two legs depending substantially perpendicularly therefrom that slidingly engage the support members. The two legs have slots therethrough configured to receive fasteners that, when secured to support members, secure and maintain the extension member in position. First and second panels protrude laterally from the frame structure to form an extension area, from which a bracket hingedly depends. A variety of pin arrangements are used to prevent the removal of the bracket from the hinge.

Abstract: An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.

Abstract: A land grid array (LGA) cooling assembly and method of a cooling member assembly are provided. The LGA assembly includes a card, a module electrically connected to the card, a plurality of load posts operably attached to the card, a load frame operably attached to the load posts, and a cooling member operably attached to the load frame to allow removal of the cooling member from the assembly without disrupting the electrical connection between the module and the card. The method of assembling a land grid array cooling member assembly includes electrically connecting a module and a card, operably connecting a load frame to the card, and removably attaching a cooling member the load frame without affecting the electrical connection between the module and the card.

Abstract: An earthquake resistant frame structure which is shippable in a fully populated condition has a base member, a plurality of support members extending from the base member, a top portion disposed over the ends of the support members, a extension member disposed over the top portion, side stiffeners positioned perpendicularly between the support members, and a tie down assembly system positioned between the base member and a flooring surface. The extension member has a platform section and at least two legs depending substantially perpendicularly therefrom that slidingly engage the support members. The two legs have slots therethrough configured to receive fasteners that, when secured to support members, secure and maintain the extension member in position. First and second panels protrude laterally from the frame structure to form an extension area, from which a bracket hingedly depends. A variety of pin arrangements are used to prevent the removal of the bracket from the hinge.

Abstract: An earthquake resistant frame structure which is shippable in a fully populated condition has a base member, a plurality of support members extending from the base member, a top portion disposed over the ends of the support members, a extension member disposed over the top portion, side stiffeners positioned perpendicularly between the support members, and a tie down assembly system positioned between the base member and a flooring surface. The extension member has a platform section and at least two legs depending substantially perpendicularly therefrom that slidingly engage the support members. The two legs have slots therethrough configured to receive fasteners that, when secured to support members, secure and maintain the extension member in position. First and second panels protrude laterally from the frame structure to form an extension area, from which a bracket hingedly depends. A variety of pin arrangements are used to prevent the removal of the bracket from the hinge.