Patents by Inventor John S. Cuendet

John S. Cuendet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost microelectronic circuit package
    Patent number: 7183658
    Abstract: A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: February 27, 2007
    Assignee: Intel Corporation
    Inventors: Steven Towle, John Tang, John S. Cuendet, Henning Braunisch, Thomas S. Dory
  • Low cost microelectronic circuit package
    Publication number: 20030045083
    Abstract: A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.
    Type: Application
    Filed: September 5, 2001
    Publication date: March 6, 2003
    Applicant: Intel Corporation
    Inventors: Steven Towle, John Tang, John S. Cuendet, Henning Braunisch, Thomas S. Dory