Abstract: A frequency selective leveling loop that performs phase and amplitude control of multiple signals within a phased array structure is disclosed. The leveling loop sensor components are embedded into the array structure. The frequency selective leveling loop can be used with multiple signal amplifiers, and a conventional phase array jamming system can be used to radiate multiple signals simultaneously. The conversion of phase information to baseband eliminates the need for phase matched cables. The frequency selective leveling that is enabled is tolerant of multiple signals and provides the individual signal phase and amplitude feedback by utilizing analytic sampling.

Abstract: A high frequency coax via structure is configured with a stripped semi-rigid cable (no shield), and an inductive compensation loop to mitigate transition discontinuity between that via structure's center conductor and the pad to which the center conductor is connected. The performance of top-to-bottom microwave transitions at high frequencies (e.g., 1 to 12 GHz) for such boards is enhanced. A non-metallized via hole embodiment that is configured with surrounding ground vias provides a greater degree of compensation for connection pads associated with greater capacitance (such as those coupled to a component).

Abstract: A high frequency coax transmission line structure is configured with a stripped semi-rigid cable (no shield). The stripped cable is inserted lengthwise into a metallized grounded slot formed in a printed wiring board. The dielectric barrel of the stripped cable contacts each of the elongated side and bottom walls of the slot. An exposed portion of center conductor at each end of the cable lays tangent on a corresponding one of connection points (at each end of the slot). The structure reduces loss for long transmission line lengths, and fixes the mounting depth and routing for a consistent transition. Inductive compensation can be provided at the connections point at each end of the slot to mitigate transition discontinuity.

Abstract: Techniques that enable the transitioning of high frequency signals on a printed wiring board processed in accordance with industry standards (such as the IPC specifications) are disclosed. One embodiment provides a high frequency via structure for a printed wiring board, where the via structure includes a via pad configured in accordance with IPC standards. A printed microwave transmission line having an inductive section is connected to the via pad, wherein the inductive section has dimensions to compensate for transition discontinuity.

Abstract: An RF transmission system including an RF power amplifier, said system comprising an harmonic cancellation processor. The harmonic cancellation processor produces a predistorted RF input signal to the RF amplifier which cancels harmonic energy generated by the amplifier. The RF output of the amplifier is sampled and stored in the harmonic cancellation processor.