Abstract: Embodiments of the present invention can provide a substrate and a moveable reflector, on the substrate, having first and second opposing surfaces, wherein the moveable reflector moves to first and second positions on the substrate. A latch is located on the substrate adjacent to the first surface of the moveable reflector opposite the second surface and coupled to the moveable reflector, wherein the latch holds the moveable reflector in the first and second positions. An actuator is located on the substrate adjacent to the first surface of the moveable reflector opposite the second surface and is coupled to the latch, wherein the actuator moves the moveable reflector to the first and second positions.

Abstract: Embodiments of the present invention can provide a substrate and a moveable reflector, on the substrate, having first and second opposing surfaces, wherein the moveable reflector moves to first and second positions on the substrate. A latch is located on the substrate adjacent to the first surface of the moveable reflector opposite the second surface and coupled to the moveable reflector, wherein the latch holds the moveable reflector in the first and second positions. An actuator is located on the substrate adjacent to the first surface of the moveable reflector opposite the second surface and is coupled to the latch, wherein the actuator moves the moveable reflector to the first and second positions.

Abstract: Contamination levels in plasma processes are reduced during plasma processing, by prevention of formation of particles, by preventing entry of particles externally introduced or by removing particles spontaneously formed from chemical and/or mechanical sources. Some techniques for prevention of formation of particles include interruption of the plasma by pulsing the source of plasma energy periodically, or application of energy to provide mechanical agitation such as mechanical shockwaves, acoustic stress, ultrasonic stress, vibrational stress, thermal stress, and pressure stress. Following a period of applied stress, a tool is pumped out (if a plasma is used, the glow is first discontinued), vented, opened and flaked or particulate material is cleaned from the lower electrode and other surfaces. A burst of filtered air or nitrogen, or a vacuum cleaner is used for removal of deposition debris while the vented tool is open. Following this procedure, the tool is then be used for product runs.

Abstract: Contamination levels in plasma processes are reduced during plasma processing, by prevention of formation of particles, by preventing entry of particles externally introduced or by removing particles spontaneously formed from chemical and/or mechanical sources. Some techniques for prevention of formation of particles include interruption of the plasma by pulsing the source of plasma energy periodically, or application of energy to provide mechanical agitation such as mechanical shockwaves, acoustic stress, ultrasonic stress, vibrational stress, thermal stress, and pressure stress. Following a period of applied stress, a tool is pumped out (if a plasma is used, the glow is first discontinued), vented, opened and flaked or particulate material is cleaned from the lower electrode and other surfaces. A burst of filtered air or nitrogen, or a vacuum cleaner is used for removal of deposition debris while the vented tool is open.