Patents by Inventor John S. Whiteley

John S. Whiteley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fault tolerant laser diode package
    Patent number: 7860136
    Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: December 28, 2010
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Edward F. Stephens, IV, Joseph L Levy, John S. Whiteley
  • Fault tolerant laser diode package
    Patent number: 7330491
    Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: February 12, 2008
    Assignee: Northrop Grumman Space & Missions Systems Corporation
    Inventors: Edward F. Stephens, IV, Joseph L. Levy, John S. Whiteley
  • Fault tolerant laser diode package
    Publication number: 20040196879
    Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).
    Type: Application
    Filed: April 20, 2004
    Publication date: October 7, 2004
    Inventors: Edward F. Stephens, Joseph L. Levy, John S. Whiteley
  • Fault tolerant laser diode package
    Patent number: 6728275
    Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: April 27, 2004
    Assignee: TRW Inc.
    Inventors: Edward F. Stephens, IV, Joseph L. Levy, John S. Whiteley
  • FAULT TOLERANT LASER DIODE PACKAGE
    Publication number: 20040057479
    Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).
    Type: Application
    Filed: September 19, 2002
    Publication date: March 25, 2004
    Inventors: Edward F. Stephens, Joseph L. Levy, John S. Whiteley