Abstract: An oligoamide-modified elastomer includes an elastomer having oligoamide units grafted to the elastomer and forming a plurality of sheet-like structures through hydrogen bonding, the sheet-like structures interacting through non-covalent interactions to form crystalized domains within the elastomer.

Abstract: An oligoamide-modified elastomer includes an elastomer having oligoamide units grafted to the elastomer and forming a plurality of sheet-like structures through hydrogen bonding, the sheet-like structures interacting through non-covalent interactions to form crystalized domains within the elastomer.

Abstract: An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The levering member biases the positioning member toward a printed circuit board in response to the clamping force. The positioning member positions the printed circuit board and a component disposed on the printed circuit board in response to the positioning member bias. In one embodiment, the positioning member positions the component to contact a thermal device.

Abstract: A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.

Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.