Patents by Inventor John Schmittendorf

John Schmittendorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly moisture-sensitive electronic device element and method for fabrication
    Patent number: 7091605
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: August 15, 2006
    Assignee: Eastman Kodak Company
    Inventors: Michael L. Boroson, John Schmittendorf, Jeffrey P. Serbicki
  • Highly moisture-sensitive electronic device element and method for fabrication
    Patent number: 6818479
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: November 16, 2004
    Assignee: Eastman Kodak Company
    Inventors: Michael L. Boroson, John Schmittendorf, Jeffrey P. Serbicki
  • Highly moisture-sensitive electronic device element and method for fabrication
    Publication number: 20030211644
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
    Type: Application
    Filed: April 9, 2003
    Publication date: November 13, 2003
    Inventors: Michael L. Boroson, John Schmittendorf, Jeffrey P. Serbicki
  • Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
    Patent number: 6594916
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
    Type: Grant
    Filed: May 17, 2002
    Date of Patent: July 22, 2003
    Assignee: Eastman Kodak Company
    Inventors: Michael L. Boroson, John Schmittendorf, Peter G. Bessey, Jeffrey P. Serbicki
  • Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
    Patent number: 6590157
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: July 8, 2003
    Assignee: Eastman Kodak Company
    Inventors: Michael L. Boroson, John Schmittendorf, Peter G. Bessey, Jeffrey P. Serbicki
  • Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
    Publication number: 20030062186
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
    Type: Application
    Filed: September 21, 2001
    Publication date: April 3, 2003
    Applicant: Eastman Kodak Company
    Inventors: Michael L. Boroson, John Schmittendorf, Peter G. Bessey, Jeffrey P. Serbicki
  • Highly moisture-sensitive electronic device element and method for fabrication
    Publication number: 20030057574
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
    Type: Application
    Filed: September 21, 2001
    Publication date: March 27, 2003
    Applicant: Eastman Kodak Company
    Inventors: Michael L. Boroson, John Schmittendorf, Jeffrey P. Serbicki
  • HIGHLY MOISTURE-SENSITIVE ELECTRONIC DEVICE ELEMENT AND METHOD FOR FABRICATION UTILIZING VENT HOLES OR GAPS
    Publication number: 20030056392
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
    Type: Application
    Filed: May 17, 2002
    Publication date: March 27, 2003
    Inventors: Michael L. Boroson, John Schmittendorf, Peter G. Bessey, Jeffrey P. Serbicki
  • Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
    Patent number: 6470594
    Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: October 29, 2002
    Assignee: Eastman Kodak Company
    Inventors: Michael L. Boroson, John Schmittendorf, Peter G. Bessey, Jeffrey P. Serbicki