Abstract: An engineered wood flooring removal apparatus for use with a buffer machine to remove bottom ply and adhesive layers of the wood flooring is provided. The apparatus effectively dislodges the bottom ply and adhesive layers with enhanced efficiency while minimizing the production of hazardous airborne particulates. The apparatus includes a base member rotatably mounted to the buffer machine, a support pad coupled to the base member, a disc member coupled to the support pad, and a plurality of cutting members coupled to the disc member. Each cutting member has an upper exposed head and a lower member that extends through the disc member, the support pad and the base member. The upper exposed heads of the cutting members contact the bottom ply and adhesive layers of the engineered wood flooring and dislodge the layers during a rotation of the base member when the buffer machine is enabled.