Patents by Inventor John Sidenstick

John Sidenstick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low toxicity solvent system for polyamideimide resins and solvent system manufacture
    Patent number: 9751986
    Abstract: Disclosed is a low toxicity aprotic alkyl amide solvent system used for the manufacture and application of polyamideimide resins, and an efficient method for manufacturing the polyamideimide resins in a solvent system in a single reaction with distillation which allows recycling of intermediate streams. The solvent system can be used for either the manufacture or the dissolution of polyamideimide resins.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: September 5, 2017
    Assignee: FUJIFILM HUNT CHEMICALS US, INC.
    Inventors: John Sidenstick, David Noga, Kathryn Mullins, Mace Phillips
  • LOW TOXICITY SOLVENT SYSTEM FOR POLYAMIDEIMIDE RESINS AND SOLVENT SYSTEM MANUFACTURE
    Publication number: 20160002408
    Abstract: Disclosed is a low toxicity aprotic alkyl amide solvent system used for the manufacture and application of polyamideimide resins, and an efficient method for manufacturing the polyamideimide resins in a solvent system in a single reaction with distillation which allows recycling of intermediate streams. The solvent system can be used for either the manufacture or the dissolution of polyamideimide resins.
    Type: Application
    Filed: December 17, 2012
    Publication date: January 7, 2016
    Inventors: John Sidenstick, David Noga, Kathryn Mullins, Mace Phillips
  • Low toxicity solvent system for polyamideimide and polyamide amic acid resins and coating solutions thereof
    Patent number: 9029441
    Abstract: Disclosed is a low toxicity aprotic alkyl amide solvent system used for the dissolution and application of polyamideimide and polyamide amic acid polymer resins. The solvent system can be used for the dissolution of polyamideimide and polyamide amic acid resins as an efficient method for incorporating these resins into functional coating compositions with the use of the solvent system.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 12, 2015
    Assignee: Fujifilm Hunt Chemicals US, Inc.
    Inventors: John Sidenstick, Russell Scott Clouston, Kathryn Mullins
  • Low Toxicity Solvent System for Polyamideimide and Polyamide Amic Acid Resins and Coating Solutions Thereof
    Publication number: 20130217812
    Abstract: Disclosed is a low toxicity aprotic alkyl amide solvent system used for the dissolution and application of polyamideimide and polyamide amic acid polymer resins. The solvent system can be used for the dissolution of polyamideimide and polyamide amic acid resins as an efficient method for incorporating these resins into functional coating compositions with the use of the solvent system.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 22, 2013
    Inventors: John Sidenstick, Russell Scott Clouston, Kathryn Mullins