Patents by Inventor John Song
John Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12297507Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.Type: GrantFiled: August 4, 2022Date of Patent: May 13, 2025Assignee: The Regents of the University of Colorado, a body corporateInventors: Shi-Long Lu, John Song
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Patent number: 11984570Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.Type: GrantFiled: August 5, 2022Date of Patent: May 14, 2024Assignee: Laird Technologies, Inc.Inventors: Jason L. Strader, John Song
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Publication number: 20240013365Abstract: Methods and systems for determining information for a specimen are provided. One system includes a computer subsystem and one or more components executed by the computer subsystem that include a deep learning (DL) model trained without labeled data (e.g., in an unsupervised or self-supervised manner) and configured to generate a reference for a specimen from one or more inputs that include at least a specimen image or data generated from the specimen image. The computer subsystem is configured for determining information for the specimen from the reference and at least the specimen image or the data generated from the specimen image.Type: ApplicationFiled: February 14, 2022Publication date: January 11, 2024Inventors: Jing Zhang, Rajkumar Theagarajan, Yujie Dong, John Song, Kris Bhaskar
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Publication number: 20230260100Abstract: Methods and systems for determining information for a specimen are provided. One system includes a computer subsystem and one or more components executed by the computer subsystem that include a deep learning (DL) model trained without labeled data (e.g., in an unsupervised or self-supervised manner) and configured to generate a reference for a specimen from one or more inputs that include at least a specimen image or data generated from the specimen image. The computer subsystem is configured for determining information for the specimen from the reference and at least the specimen image or the data generated from the specimen image.Type: ApplicationFiled: February 14, 2022Publication date: August 17, 2023Inventors: Jing Zhang, Rajkumar Theagarajan, Yujie Dong, John Song, Kris Bhaskar
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Publication number: 20230071575Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.Type: ApplicationFiled: August 4, 2022Publication date: March 9, 2023Inventors: Shi-Long Lu, John Song
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Publication number: 20220376322Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.Type: ApplicationFiled: August 5, 2022Publication date: November 24, 2022Inventors: Jason L. STRADER, John SONG
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Patent number: 11441193Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.Type: GrantFiled: April 24, 2020Date of Patent: September 13, 2022Assignee: The Regents of the University of Colorado, a body corporateInventors: Shi-long Lu, John Song
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Patent number: 11411263Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.Type: GrantFiled: March 6, 2020Date of Patent: August 9, 2022Assignee: Laird Technologies, Inc.Inventors: Jason L. Strader, John Song
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Publication number: 20200287253Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.Type: ApplicationFiled: March 6, 2020Publication date: September 10, 2020Inventors: Jason L. STRADER, John SONG
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Publication number: 20200277678Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.Type: ApplicationFiled: April 24, 2020Publication date: September 3, 2020Inventors: Shi-long LU, John SONG
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Patent number: 10640831Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.Type: GrantFiled: October 16, 2015Date of Patent: May 5, 2020Assignee: The Regents of the University of Colorado, a body corporateInventors: Shi-long Lu, John Song
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Patent number: 10631398Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.Type: GrantFiled: July 24, 2019Date of Patent: April 21, 2020Assignee: Laird Technologies, Inc.Inventors: John Song, George William Rhyne
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Publication number: 20190350075Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.Type: ApplicationFiled: July 24, 2019Publication date: November 14, 2019Inventors: John SONG, George William RHYNE
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Patent number: 10368432Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.Type: GrantFiled: June 8, 2018Date of Patent: July 30, 2019Assignee: LAIRD TECHNOLOGIES, INC.Inventors: John Song, George William Rhyne
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Patent number: 10278314Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).Type: GrantFiled: January 12, 2018Date of Patent: April 30, 2019Assignee: LAIRD TECHNOLOGIES, INC.Inventors: John Song, Gerald R. English, Mohammadali Khorrami, Paul Francis Dixon
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Publication number: 20180295713Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.Type: ApplicationFiled: June 8, 2018Publication date: October 11, 2018Inventors: John SONG, George William RHYNE
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Patent number: 9999122Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.Type: GrantFiled: October 13, 2017Date of Patent: June 12, 2018Assignee: Laird Technologies, Inc.Inventors: John Song, George William Rhyne
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Publication number: 20180139872Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).Type: ApplicationFiled: January 12, 2018Publication date: May 17, 2018Inventors: John Song, Gerald R. English, Mohammadali Khorrami, Paul Francis Dixon
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Publication number: 20180042103Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.Type: ApplicationFiled: October 13, 2017Publication date: February 8, 2018Inventors: John Song, George William Rhyne
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Patent number: D860878Type: GrantFiled: May 8, 2018Date of Patent: September 24, 2019Assignee: International Truck Intellectual Property Company, LLCInventors: Chris Ito, Glen Durmisevich, Christian Hardin, Tak Lee, John Song, James Box