Patents by Inventor John Song

John Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12297507
    Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: May 13, 2025
    Assignee: The Regents of the University of Colorado, a body corporate
    Inventors: Shi-Long Lu, John Song
  • Patent number: 11984570
    Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 14, 2024
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, John Song
  • Publication number: 20240013365
    Abstract: Methods and systems for determining information for a specimen are provided. One system includes a computer subsystem and one or more components executed by the computer subsystem that include a deep learning (DL) model trained without labeled data (e.g., in an unsupervised or self-supervised manner) and configured to generate a reference for a specimen from one or more inputs that include at least a specimen image or data generated from the specimen image. The computer subsystem is configured for determining information for the specimen from the reference and at least the specimen image or the data generated from the specimen image.
    Type: Application
    Filed: February 14, 2022
    Publication date: January 11, 2024
    Inventors: Jing Zhang, Rajkumar Theagarajan, Yujie Dong, John Song, Kris Bhaskar
  • Publication number: 20230260100
    Abstract: Methods and systems for determining information for a specimen are provided. One system includes a computer subsystem and one or more components executed by the computer subsystem that include a deep learning (DL) model trained without labeled data (e.g., in an unsupervised or self-supervised manner) and configured to generate a reference for a specimen from one or more inputs that include at least a specimen image or data generated from the specimen image. The computer subsystem is configured for determining information for the specimen from the reference and at least the specimen image or the data generated from the specimen image.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 17, 2023
    Inventors: Jing Zhang, Rajkumar Theagarajan, Yujie Dong, John Song, Kris Bhaskar
  • Publication number: 20230071575
    Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.
    Type: Application
    Filed: August 4, 2022
    Publication date: March 9, 2023
    Inventors: Shi-Long Lu, John Song
  • Publication number: 20220376322
    Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 24, 2022
    Inventors: Jason L. STRADER, John SONG
  • Patent number: 11441193
    Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: September 13, 2022
    Assignee: The Regents of the University of Colorado, a body corporate
    Inventors: Shi-long Lu, John Song
  • Patent number: 11411263
    Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: August 9, 2022
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, John Song
  • Publication number: 20200287253
    Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 10, 2020
    Inventors: Jason L. STRADER, John SONG
  • Publication number: 20200277678
    Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.
    Type: Application
    Filed: April 24, 2020
    Publication date: September 3, 2020
    Inventors: Shi-long LU, John SONG
  • Patent number: 10640831
    Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 5, 2020
    Assignee: The Regents of the University of Colorado, a body corporate
    Inventors: Shi-long Lu, John Song
  • Patent number: 10631398
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 21, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: John Song, George William Rhyne
  • Publication number: 20190350075
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Application
    Filed: July 24, 2019
    Publication date: November 14, 2019
    Inventors: John SONG, George William RHYNE
  • Patent number: 10368432
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: July 30, 2019
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: John Song, George William Rhyne
  • Patent number: 10278314
    Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: April 30, 2019
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: John Song, Gerald R. English, Mohammadali Khorrami, Paul Francis Dixon
  • Publication number: 20180295713
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Application
    Filed: June 8, 2018
    Publication date: October 11, 2018
    Inventors: John SONG, George William RHYNE
  • Patent number: 9999122
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: June 12, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: John Song, George William Rhyne
  • Publication number: 20180139872
    Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).
    Type: Application
    Filed: January 12, 2018
    Publication date: May 17, 2018
    Inventors: John Song, Gerald R. English, Mohammadali Khorrami, Paul Francis Dixon
  • Publication number: 20180042103
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Application
    Filed: October 13, 2017
    Publication date: February 8, 2018
    Inventors: John Song, George William Rhyne
  • Patent number: D860878
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: September 24, 2019
    Assignee: International Truck Intellectual Property Company, LLC
    Inventors: Chris Ito, Glen Durmisevich, Christian Hardin, Tak Lee, John Song, James Box